JAJSDV5G June   2009  – January 2017 TMS320C6748

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 DSP Subsystem
      1. 3.3.1 C674x DSP CPU Description
      2. 3.3.2 DSP Memory Mapping
        1. 3.3.2.1 External Memories
        2. 3.3.2.2 DSP Internal Memories
        3. 3.3.2.3 C674x CPU
    4. 3.4 Memory Map Summary
      1. Table 3-4 C6748 Top Level Memory Map
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Pin Multiplexing Control
    7. 3.7 Terminal Functions
      1. 3.7.1  Device Reset, NMI and JTAG
      2. 3.7.2  High-Frequency Oscillator and PLL
      3. 3.7.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.7.4  DEEPSLEEP Power Control
      5. 3.7.5  External Memory Interface A (EMIFA)
      6. 3.7.6  DDR2/mDDR Controller
      7. 3.7.7  Serial Peripheral Interface Modules (SPI)
      8. 3.7.8  Programmable Real-Time Unit (PRU)
      9. 3.7.9  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      10. 3.7.10 Enhanced Pulse Width Modulators (eHRPWM)
      11. 3.7.11 Boot
      12. 3.7.12 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      13. 3.7.13 Inter-Integrated Circuit Modules(I2C0, I2C1)
      14. 3.7.14 Timers
      15. 3.7.15 Multichannel Audio Serial Ports (McASP)
      16. 3.7.16 Multichannel Buffered Serial Ports (McBSP)
      17. 3.7.17 Universal Serial Bus Modules (USB0, USB1)
      18. 3.7.18 Ethernet Media Access Controller (EMAC)
      19. 3.7.19 Multimedia Card/Secure Digital (MMC/SD)
      20. 3.7.20 Liquid Crystal Display Controller(LCD)
      21. 3.7.21 Serial ATA Controller (SATA)
      22. 3.7.22 Universal Host-Port Interface (UHPI)
      23. 3.7.23 Universal Parallel Port (uPP)
      24. 3.7.24 Video Port Interface (VPIF)
      25. 3.7.25 General Purpose Input Output
      26. 3.7.26 Reserved and No Connect
      27. 3.7.27 Supply and Ground
    8. 3.8 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 DSP Interrupts
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Power Domain States
        2. 6.8.1.2 Module States
    9. 6.9  Enhanced Direct Memory Access Controller (EDMA3)
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA3 Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 EMIFA Connection Examples
      5. 6.10.5 External Memory Interface Register Descriptions
      6. 6.10.6 EMIFA Electrical Data/Timing
        1. Table 6-19 Timing Requirements for EMIFA SDRAM Interface
        2. Table 6-20 Switching Characteristics for EMIFA SDRAM Interface
        3. Table 6-21 Timing Requirements for EMIFA Asynchronous Memory Interface
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Memory Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 DDR2/mDDR Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
        1. Table 6-40 Timing Requirements for MMC/SD (see and )
        2. Table 6-41 Switching Characteristics for MMC/SD (see through )
    14. 6.14 Serial ATA Controller (SATA)
      1. 6.14.1 SATA Register Descriptions
      2. 6.14.2 1. SATA Interface
        1. 6.14.2.1 SATA Interface Schematic
        2. 6.14.2.2 Compatible SATA Components and Modes
        3. 6.14.2.3 PCB Stackup Specifications
        4. 6.14.2.4 Routing Specifications
        5. 6.14.2.5 Coupling Capacitors
        6. 6.14.2.6 SATA Interface Clock Source requirements
      3. 6.14.3 SATA Unused Signal Configuration
    15. 6.15 Multichannel Audio Serial Port (McASP)
      1. 6.15.1 McASP Peripheral Registers Description(s)
      2. 6.15.2 McASP Electrical Data/Timing
        1. 6.15.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-52 Timing Requirements for McASP0 (1.3V, 1.2V, 1.1V)
          2. Table 6-53 Timing Requirements for McASP0 (1.0V)
          3. Table 6-54 Switching Characteristics for McASP0 (1.3V, 1.2V, 1.1V)
          4. Table 6-55 Switching Characteristics for McASP0 (1.0V)
    16. 6.16 Multichannel Buffered Serial Port (McBSP)
      1. 6.16.1 McBSP Peripheral Register Description(s)
      2. 6.16.2 McBSP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Buffered Serial Port (McBSP) Timing
          1. Table 6-57 Timing Requirements for McBSP0 [1.3V, 1.2V, 1.1V] (see )
          2. Table 6-58 Timing Requirements for McBSP0 [1.0V] (see )
          3. Table 6-59 Switching Characteristics for McBSP0 [1.3V, 1.2V, 1.1V] (see )
          4. Table 6-60 Switching Characteristics for McBSP0 [1.0V] (see )
          5. Table 6-61 Timing Requirements for McBSP1 [1.3V, 1.2V, 1.1V] (see )
          6. Table 6-62 Timing Requirements for McBSP1 [1.0V] (see )
          7. Table 6-63 Switching Characteristics for McBSP1 [1.3V, 1.2V, 1.1V] (see )
          8. Table 6-64 Switching Characteristics for McBSP1 [1.0V] (see )
          9. Table 6-65 Timing Requirements for McBSP0 FSR When GSYNC = 1 (see )
          10. Table 6-66 Timing Requirements for McBSP1 FSR When GSYNC = 1 (see )
    17. 6.17 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-68 General Timing Requirements for SPI0 Master Modes
          2. Table 6-69 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-76 General Timing Requirements for SPI1 Master Modes
          4. Table 6-77 General Timing Requirements for SPI1 Slave Modes
          5. Table 6-78 Additional SPI1 Master Timings, 4-Pin Enable Option
          6. Table 6-79 Additional SPI1 Master Timings, 4-Pin Chip Select Option
    18. 6.18 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.18.1 I2C Device-Specific Information
      2. 6.18.2 I2C Peripheral Registers Description(s)
      3. 6.18.3 I2C Electrical Data/Timing
        1. 6.18.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-85 Timing Requirements for I2C Input
          2. Table 6-86 Switching Characteristics for I2C
    19. 6.19 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.19.1 UART Peripheral Registers Description(s)
      2. 6.19.2 UART Electrical Data/Timing
        1. Table 6-88 Timing Requirements for UART Receive (see )
        2. Table 6-89 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    20. 6.20 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.20.1 USB0 [USB2.0] Electrical Data/Timing
        1. Table 6-91 Switching Characteristics Over Recommended Operating Conditions for USB0 [USB2.0] (see )
    21. 6.21 Universal Serial Bus Host Controller (USB1) [USB1.1 OHCI]
      1. Table 6-93 Switching Characteristics Over Recommended Operating Conditions for USB1 [USB1.1]
    22. 6.22 Ethernet Media Access Controller (EMAC)
      1. 6.22.1 EMAC Peripheral Register Description(s)
        1. 6.22.1.1 EMAC Electrical Data/Timing
          1. Table 6-98   Timing Requirements for MII_RXCLK (see )
          2. Table 6-99   Timing Requirements for MII_TXCLK (see )
          3. Table 6-100 Timing Requirements for EMAC MII Receive 10/100 Mbit/s (see )
          4. Table 6-101 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10/100 Mbit/s (see )
    23. 6.23 Management Data Input/Output (MDIO)
      1. 6.23.1 MDIO Register Description(s)
      2. 6.23.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-105 Timing Requirements for MDIO Input (see and )
        2. Table 6-106 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    24. 6.24 LCD Controller (LCDC)
      1. 6.24.1 LCD Interface Display Driver (LIDD Mode)
      2. 6.24.2 LCD Raster Mode
        1. Table 6-110 Switching Characteristics Over Recommended Operating Conditions for LCD Raster Mode
    25. 6.25 Host-Port Interface (UHPI)
      1. 6.25.1 HPI Device-Specific Information
      2. 6.25.2 HPI Peripheral Register Description(s)
      3. 6.25.3 HPI Electrical Data/Timing
        1. Table 6-112 Timing Requirements for Host-Port Interface [1.2V, 1.1V]
        2. Table 6-113 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.3V, 1.2V, 1.1V]
        3. Table 6-114 Switching Characteristics Over Recommended Operating Conditions for Host-Port Interface [1.0V]
    26. 6.26 Universal Parallel Port (uPP)
      1. 6.26.1 uPP Register Descriptions
        1. Table 6-115 Universal Parallel Port (uPP) Registers
      2. 6.26.2 uPP Electrical Data/Timing
        1. Table 6-116 Timing Requirements for uPP (see , , , )
        2. Table 6-117 Switching Characteristics Over Recommended Operating Conditions for uPP
    27. 6.27 Video Port Interface (VPIF)
      1. 6.27.1 VPIF Register Descriptions
        1. Table 6-118 Video Port Interface (VPIF) Registers
      2. 6.27.2 VPIF Electrical Data/Timing
        1. Table 6-119 Timing Requirements for VPIF VP_CLKINx Inputs (see )
        2. Table 6-120 Timing Requirements for VPIF Channels 0/1 Video Capture Data and Control Inputs (see )
        3. Table 6-121 Switching Characteristics Over Recommended Operating Conditions for Video Data Shown With Respect to VP_CLKOUT2/3 (see )
    28. 6.28 Enhanced Capture (eCAP) Peripheral
      1. Table 6-123 Timing Requirements for Enhanced Capture (eCAP)
      2. Table 6-124 Switching Characteristics Over Recommended Operating Conditions for eCAP
    29. 6.29 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.29.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-126 Timing Requirements for eHRPWM
        2. Table 6-127 Switching Characteristics Over Recommended Operating Conditions for eHRPWM
      2. 6.29.2 Trip-Zone Input Timing
    30. 6.30 Timers
      1. 6.30.1 Timer Electrical Data/Timing
        1. Table 6-130 Timing Requirements for Timer Input (see )
        2. Table 6-131 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    31. 6.31 Real Time Clock (RTC)
      1. 6.31.1 Clock Source
      2. 6.31.2 Real-Time Clock Register Descriptions
    32. 6.32 General-Purpose Input/Output (GPIO)
      1. 6.32.1 GPIO Register Description(s)
      2. 6.32.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-134 Timing Requirements for GPIO Inputs (see )
        2. Table 6-135 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.32.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-136 Timing Requirements for External Interrupts (see )
    33. 6.33 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.33.1 PRUSS Register Descriptions
    34. 6.34 Emulation Logic
      1. 6.34.1 JTAG Port Description
      2. 6.34.2 Scan Chain Configuration Parameters
      3. 6.34.3 Initial Scan Chain Configuration
      4. 6.34.4 IEEE 1149.1 JTAG
        1. 6.34.4.1 JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0)
        2. 6.34.4.2 JTAG Test-Port Electrical Data/Timing
          1. Table 6-147 Timing Requirements for JTAG Test Port (see )
          2. Table 6-148 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
      5. 6.34.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 Community Resources
    5. 7.5 商標
    6. 7.6 静電気放電に関する注意事項
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZCE Package
    2. 8.2 Thermal Data for ZWT Package
    3. 8.3 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZCE|361
  • ZWT|361
サーマルパッド・メカニカル・データ
発注情報

Table 6-21 Timing Requirements for EMIFA Asynchronous Memory Interface (1)

NO. 1.3V, 1.2V 1.1V 1.0V UNIT
MIN MAX MIN MAX MIN MAX
READS and WRITES
E tc(CLK) Cycle time, EMIFA module clock 6.75 13.33 20 ns
2 tw(EM_WAIT) Pulse duration, EM_WAIT assertion and deassertion 2E 2E 2E ns
READS
12 tsu(EMDV-EMOEH) Setup time, EM_D[15:0] valid before EM_OE high 3 5 7 ns
13 th(EMOEH-EMDIV) Hold time, EM_D[15:0] valid after EM_OE high 0 0 0 ns
14 tsu(EMOEL-EMWAIT) Setup Time, EM_WAIT asserted before end of Strobe Phase(2) 4E+3 4E+3 4E+3 ns
WRITES
28 tsu(EMWEL-EMWAIT) Setup Time, EM_WAIT asserted before end of Strobe Phase(2) 4E+3 4E+3 4E+3 ns
(1) E = EMA_CLK period or in ns. EMA_CLK is selected either as SYSCLK3 or the PLL0 output clock divided by 4.5. As an example, when SYSCLK3 is selected and set to 100MHz, E=10ns
(2) Setup before end of STROBE phase (if no extended wait states are inserted) by which EM_WAIT must be asserted to add extended wait states. Figure 6-16 and Figure 6-17 describe EMIF transactions that include extended wait states inserted during the STROBE phase. However, cycles inserted as part of this extended wait period should not be counted; the 4E requirement is to the start of where the HOLD phase would begin if there were no extended wait cycles.

Table 6-22 Switching Characteristics for EMIFA Asynchronous Memory Interface (1)(2)(3)

NO. PARAMETER 1.3V, 1.2V, 1.1V, 1.0V UNIT
MIN Nom MAX
READS and WRITES
1 td(TURNAROUND) Turn around time (TA)*E - 3 (TA)*E (TA)*E + 3 ns
READS
3 tc(EMRCYCLE) EMIF read cycle time (EW = 0) (RS+RST+RH)*E - 3 (RS+RST+RH)*E (RS+RST+RH)*E + 3 ns
EMIF read cycle time (EW = 1) (RS+RST+RH+EWC)*E - 3 (RS+RST+RH+EWC)*E (RS+RST+RH+EWC)*E + 3 ns
4 tsu(EMCEL-EMOEL) Output setup time, EMA_CE[5:2] low to EMA_OE low (SS = 0) (RS)*E-3 (RS)*E (RS)*E+3 ns
Output setup time, EMA_CE[5:2] low to EMA_OE low (SS = 1) -3 0 +3 ns
5 th(EMOEH-EMCEH) Output hold time, EMA_OE high to EMA_CE[5:2] high (SS = 0) (RH)*E - 3 (RH)*E (RH)*E + 3 ns
Output hold time, EMA_OE high to EMA_CE[5:2] high (SS = 1) -3 0 +3 ns
6 tsu(EMBAV-EMOEL) Output setup time, EMA_BA[1:0] valid to EMA_OE low (RS)*E-3 (RS)*E (RS)*E+3 ns
7 th(EMOEH-EMBAIV) Output hold time, EMA_OE high to EMA_BA[1:0] invalid (RH)*E-3 (RH)*E (RH)*E+3 ns
8 tsu(EMBAV-EMOEL) Output setup time, EMA_A[13:0] valid to EMA_OE low (RS)*E-3 (RS)*E (RS)*E+3 ns
9 th(EMOEH-EMAIV) Output hold time, EMA_OE high to EMA_A[13:0] invalid (RH)*E-3 (RH)*E (RH)*E+3 ns
10 tw(EMOEL) EMA_OE active low width (EW = 0) (RST)*E-3 (RST)*E (RST)*E+3 ns
EMA_OE active low width (EW = 1) (RST+EWC)*E-3 (RST+EWC)*E (RST+EWC)*E+3 ns
11 td(EMWAITH-EMOEH) Delay time from EMA_WAIT deasserted to EMA_OE high 3E-3 4E 4E+3 ns
28 tsu(EMARW-EMOEL) Output setup time, EMA_A_RW valid to EMA_OE low (RS)*E-3 (RS)*E (RS)*E+3 ns
29 th(EMOEH-EMARW) Output hold time, EMA_OE high to EMA_A_RW invalid (RH)*E-3 (RH)*E (RH)*E+3 ns
WRITES
15 tc(EMWCYCLE) EMIF write cycle time (EW = 0) (WS+WST+WH)*E-3 (WS+WST+WH)*E (WS+WST+WH)*E+3 ns
EMIF write cycle time (EW = 1) (WS+WST+WH+EWC)*E - 3 (WS+WST+WH+EWC)*E (WS+WST+WH+EWC)*E + 3 ns
16 tsu(EMCEL-EMWEL) Output setup time, EMA_CE[5:2] low to EMA_WE low (SS = 0) (WS)*E - 3 (WS)*E (WS)*E + 3 ns
Output setup time, EMA_CE[5:2] low to EMA_WE low (SS = 1) -3 0 +3 ns
17 th(EMWEH-EMCEH) Output hold time, EMA_WE high to EMA_CE[5:2] high (SS = 0) (WH)*E-3 (WH)*E (WH)*E+3 ns
Output hold time, EMA_WE high to EMA_CE[5:2] high (SS = 1) -3 0 +3 ns
18 tsu(EMDQMV-EMWEL) Output setup time, EMA_BA[1:0] valid to EMA_WE low (WS)*E-3 (WS)*E (WS)*E+3 ns
19 th(EMWEH-EMDQMIV) Output hold time, EMA_WE high to EMA_BA[1:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
20 tsu(EMBAV-EMWEL) Output setup time, EMA_BA[1:0] valid to EMA_WE low (WS)*E-3 (WS)*E (WS)*E+3 ns
21 th(EMWEH-EMBAIV) Output hold time, EMA_WE high to EMA_BA[1:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
22 tsu(EMAV-EMWEL) Output setup time, EMA_A[13:0] valid to EMA_WE low (WS)*E-3 (WS)*E (WS)*E+3 ns
23 th(EMWEH-EMAIV) Output hold time, EMA_WE high to EMA_A[13:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
24 tw(EMWEL) EMA_WE active low width (EW = 0) (WST)*E-3 (WST)*E (WST)*E+3 ns
EMA_WE active low width (EW = 1) (WST+EWC)*E-3 (WST+EWC)*E (WST+EWC)*E+3 ns
25 td(EMWAITH-EMWEH) Delay time from EMA_WAIT deasserted to EMA_WE high 3E-3 4E 4E+3 ns
26 tsu(EMDV-EMWEL) Output setup time, EMA_D[15:0] valid to EMA_WE low (WS)*E-3 (WS)*E (WS)*E+3 ns
27 th(EMWEH-EMDIV) Output hold time, EMA_WE high to EMA_D[15:0] invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
30 tsu(EMARW-EMWEL) Output setup time, EMA_A_RW valid to EMA_WE low (WS)*E-3 (WS)*E (WS)*E+3 ns
31 th(EMWEH-EMARW) Output hold time, EMA_WE high to EMA_A_RW invalid (WH)*E-3 (WH)*E (WH)*E+3 ns
(1) TA = Turn around, RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold, MEWC = Maximum external wait cycles. These parameters are programmed via the Asynchronous Bank and Asynchronous Wait Cycle Configuration Registers. These support the following range of values: TA[4-1], RS[16-1], RST[64-1], RH[8-1], WS[16-1], WST[64-1], WH[8-1], and MEW[1-256].
(2) E = EMA_CLK period or in ns. EMA_CLK is selected either as SYSCLK3 or the PLL0 output clock divided by 4.5. As an example, when SYSCLK3 is selected and set to 100MHz, E=10ns.
(3) EWC = external wait cycles determined by EMA_WAIT input signal. EWC supports the following range of values EWC[256-1]. Note that the maximum wait time before timeout is specified by bit field MEWC in the Asynchronous Wait Cycle Configuration Register.
TMS320C6748 td_async_rd_prs586.gifFigure 6-14 Asynchronous Memory Read Timing for EMIFA
TMS320C6748 td_async_wrt_prs586.gifFigure 6-15 Asynchronous Memory Write Timing for EMIFA
TMS320C6748 td_async_wrd1_prs586.gifFigure 6-16 EMA_WAIT Read Timing Requirements
TMS320C6748 td_async_wwt_prs586.gifFigure 6-17 EMA_WAIT Write Timing Requirements