SPRS357D August   2006  – June 2020 TMS320F28044

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings – Commercial
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F28044 Current Consumption by Power-Supply Pins at 100-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for F28044 100-Ball GGM Package
    7. 5.7  Thermal Resistance Characteristics for F28044 100-Pin PZ Package
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Timing Parameter Symbology
        1. 5.9.1.1 General Notes on Timing Parameters
        2. 5.9.1.2 Test Load Circuit
        3. 5.9.1.3 Device Clock Table
          1. Table 5-3 TMS320x280x Clock Table and Nomenclature
      2. 5.9.2 Power Sequencing
        1. 5.9.2.1   Power Management and Supervisory Circuit Solutions
        2. Table 5-5 Reset (XRS) Timing Requirements
      3. 5.9.3 Clock Requirements and Characteristics
        1. Table 5-6 Input Clock Frequency
        2. Table 5-7 XCLKIN Timing Requirements - PLL Enabled
        3. Table 5-8 XCLKIN Timing Requirements - PLL Disabled
        4. Table 5-9 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
      4. 5.9.4 Peripherals
        1. 5.9.4.1 General-Purpose Input/Output (GPIO)
          1. 5.9.4.1.1 GPIO - Output Timing
            1. Table 5-10 General-Purpose Output Switching Characteristics
          2. 5.9.4.1.2 GPIO - Input Timing
            1. Table 5-11 General-Purpose Input Timing Requirements
          3. 5.9.4.1.3 Sampling Window Width for Input Signals
          4. 5.9.4.1.4 Low-Power Mode Wakeup Timing
            1. Table 5-12 IDLE Mode Timing Requirements
            2. Table 5-13 IDLE Mode Switching Characteristics
            3. Table 5-14 STANDBY Mode Timing Requirements
            4. Table 5-15 STANDBY Mode Switching Characteristics
            5. Table 5-16 HALT Mode Timing Requirements
            6. Table 5-17 HALT Mode Switching Characteristics
        2. 5.9.4.2 Enhanced Control Peripherals
          1. 5.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. Table 5-18 ePWM Timing Requirements
            2. Table 5-19 ePWM Switching Characteristics
          2. 5.9.4.2.2 Trip-Zone Input Timing
            1. Table 5-20 Trip-Zone input Timing Requirements
          3. 5.9.4.2.3 High-Resolution PWM Timing
            1. Table 5-21 High Resolution PWM Characteristics at SYSCLKOUT = (60 - 100 MHz)
          4. 5.9.4.2.4 ADC Start-of-Conversion Timing
            1. Table 5-22 External ADC Start-of-Conversion Switching Characteristics
        3. 5.9.4.3 External Interrupt Timing
          1. Table 5-23 External Interrupt Timing Requirements
          2. Table 5-24 External Interrupt Switching Characteristics
        4. 5.9.4.4 I2C Electrical Specification and Timing
          1. Table 5-25 I2C Timing
        5. 5.9.4.5 Serial Peripheral Interface (SPI) Master Mode Timing
          1. Table 5-26 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 5-27 SPI Master Mode External Timing (Clock Phase = 1)
        6. 5.9.4.6 SPI Slave Mode Timing
          1. Table 5-28 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 5-29 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 5.9.5 JTAG Debug Probe Connection Without Signal Buffering for the DSP
      6. 5.9.6 Flash Timing
        1. Table 5-30 Flash Endurance for A Temperature Material
        2. Table 5-31 Flash Parameters at 100-MHz SYSCLKOUT
        3. Table 5-32 Flash/OTP Access Timing
        4. Table 5-33 Flash Data Retention Duration
    10. 5.10 On-Chip Analog-to-Digital Converter
      1. Table 5-35 ADC Electrical Characteristics (over recommended operating conditions)
      2. 5.10.1     ADC Power-Up Control Bit Timing
        1. Table 5-36 ADC Power-Up Delays
        2. Table 5-37 Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 5.10.2     Definitions
      4. 5.10.3     Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. Table 5-38 Sequential Sampling Mode Timing
      5. 5.10.4     Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. Table 5-39 Simultaneous Sampling Mode Timing
      6. 5.10.5     Detailed Descriptions
  6. 6Detailed Description
    1. 6.1 Brief Descriptions
      1. 6.1.1  C28x CPU
      2. 6.1.2  Memory Bus (Harvard Bus Architecture)
      3. 6.1.3  Peripheral Bus
      4. 6.1.4  Real-Time JTAG and Analysis
      5. 6.1.5  Flash
      6. 6.1.6  M0, M1 SARAMs
      7. 6.1.7  L0, L1 SARAMs
      8. 6.1.8  Boot ROM
      9. 6.1.9  Security
      10. 6.1.10 Peripheral Interrupt Expansion (PIE) Block
      11. 6.1.11 External Interrupts (XINT1, XINT2, XNMI)
      12. 6.1.12 Oscillator and PLL
      13. 6.1.13 Watchdog
      14. 6.1.14 Peripheral Clocking
      15. 6.1.15 Low-Power Modes
      16. 6.1.16 Peripheral Frames 0, 1, 2 (PFn)
      17. 6.1.17 General-Purpose Input/Output (GPIO) Multiplexer
      18. 6.1.18 32-Bit CPU-Timers (0, 1, 2)
      19. 6.1.19 Control Peripherals
      20. 6.1.20 Serial Port Peripherals
    2. 6.2 Peripherals
      1. 6.2.1 32-Bit CPU-Timers 0/1/2
      2. 6.2.2 Enhanced PWM Modules (ePWM1–16)
      3. 6.2.3 Hi-Resolution PWM (HRPWM)
      4. 6.2.4 Enhanced Analog-to-Digital Converter (ADC) Module
        1. 6.2.4.1 ADC Connections if the ADC Is Not Used
        2. 6.2.4.2 ADC Registers
      5. 6.2.5 Serial Communications Interface (SCI) Module (SCI-A)
      6. 6.2.6 Serial Peripheral Interface (SPI) Module (SPI-A)
      7. 6.2.7 Inter-Integrated Circuit (I2C)
      8. 6.2.8 GPIO MUX
    3. 6.3 Memory Map
    4. 6.4 Register Map
      1. 6.4.1 Device Emulation Registers
    5. 6.5 Interrupts
      1. 6.5.1 External Interrupts
    6. 6.6 System Control
      1. 6.6.1 OSC and PLL Block
        1. 6.6.1.1 External Reference Oscillator Clock Option
        2. 6.6.1.2 PLL-Based Clock Module
        3. 6.6.1.3 Loss of Input Clock
      2. 6.6.2 Watchdog Block
    7. 6.7 Low-Power Modes Block
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Support Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

パッケージ・オプション

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メカニカル・データ（パッケージ｜ピン）
  • PZ|100
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発注情報

Table 5-31 Flash Parameters at 100-MHz SYSCLKOUT

PARAMETER(2) TEST CONDITIONS MIN TYP MAX UNIT
Program Time 16-Bit Word 50 μs
16K Sector 500 ms
Erase Time(1) 16K Sector 10 S
IDD3VFLP VDD3VFL current consumption during the Erase/Program cycle Erase 75 mA
Program 35 mA
IDDP VDD current consumption during Erase/Program cycle 140 mA
IDDIOP VDDIO current consumption during Erase/Program cycle 20 mA
(1) The on-chip flash memory is in an erased state when the device is shipped from TI. As such, erasing the flash memory is not required before programming, when programming the device for the first time. However, the erase operation is needed on all subsequent programming operations.
(2) Typical parameters as seen at room temperature including function call overhead, with all peripherals off. It is important to maintain a stable power supply during the entire flash programming process. It is conceivable that device current consumption during flash programming could be higher than normal operating conditions. The power supply used should ensure VMIN on the supply rails at all times, as specified in the Recommended Operating Conditions of the data sheet. Any brownout or interruption to power during erasing/programming could potentially corrupt the password locations and lock the device permanently. Powering a target board (during flash programming) through the USB port is not recommended, as the port may be unable to respond to the power demands placed during the programming process.