JAJSEG7 December   2017 TMS320F28377D-EP

PRODUCTION DATA.  

  1. 1デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2改訂履歴
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Signal Descriptions
      1. Table 3-1 Signal Descriptions
    3. 3.3 Pins With Internal Pullup and Pulldown
    4. 3.4 Pin Multiplexing
      1. 3.4.1 GPIO Muxed Pins
      2. 3.4.2 Input X-BAR
      3. 3.4.3 Output X-BAR and ePWM X-BAR
      4. 3.4.4 USB Pin Muxing
      5. 3.4.5 High-Speed SPI Pin Muxing
    5. 3.5 Connections for Unused Pins
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Power Consumption Summary
      1. Table 4-1 Device Current Consumption at 200-MHz SYSCLK
      2. 4.4.1      Current Consumption Graphs
      3. 4.4.2      Reducing Current Consumption
    5. 4.5  Electrical Characteristics
    6. 4.6  Thermal Resistance Characteristics
      1. 4.6.1 GWT Package
      2. 4.6.2 PTP Package
    7. 4.7  System
      1. 4.7.1 Power Sequencing
        1. Table 4-3 Supply Ramp Rate
      2. 4.7.2 Reset Timing
        1. 4.7.2.1 Reset Sources
        2. 4.7.2.2 Reset Electrical Data and Timing
          1. Table 4-4 Reset (XRS) Timing Requirements
          2. Table 4-5 Reset (XRS) Switching Characteristics
      3. 4.7.3 Clock Specifications
        1. 4.7.3.1 Clock Sources
        2. 4.7.3.2 Clock Frequencies, Requirements, and Characteristics
          1. 4.7.3.2.1 Input Clock Frequency and Timing Requirements, PLL Lock Times
            1. Table 4-7   Input Clock Frequency
            2. Table 4-8   X1 Input Level Characteristics When Using an External Clock Source (Not a Crystal)
            3. Table 4-9   X1 Timing Requirements
            4. Table 4-10 AUXCLKIN Timing Requirements
            5. Table 4-11 PLL Lock Times
          2. 4.7.3.2.2 Internal Clock Frequencies
            1. Table 4-12 Internal Clock Frequencies
          3. 4.7.3.2.3 Output Clock Frequency and Switching Characteristics
            1. Table 4-13 Output Clock Frequency
            2. Table 4-14 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        3. 4.7.3.3 Input Clocks and PLLs
        4. 4.7.3.4 Crystal Oscillator
          1. Table 4-15 Crystal Oscillator Parameters
          2. Table 4-17 Crystal Oscillator Electrical Characteristics
        5. 4.7.3.5 Internal Oscillators
          1. Table 4-18 Internal Oscillator Electrical Characteristics
      4. 4.7.4 Flash Parameters
        1. Table 4-20 Flash Parameters
      5. 4.7.5 Emulation/JTAG
        1. 4.7.5.1 JTAG Electrical Data and Timing
          1. Table 4-21 JTAG Timing Requirements
          2. Table 4-22 JTAG Switching Characteristics
      6. 4.7.6 GPIO Electrical Data and Timing
        1. 4.7.6.1 GPIO - Output Timing
          1. Table 4-23 General-Purpose Output Switching Characteristics
        2. 4.7.6.2 GPIO - Input Timing
          1. Table 4-24 General-Purpose Input Timing Requirements
        3. 4.7.6.3 Sampling Window Width for Input Signals
      7. 4.7.7 Interrupts
        1. 4.7.7.1 External Interrupt (XINT) Electrical Data and Timing
          1. Table 4-25 External Interrupt Timing Requirements
          2. Table 4-26 External Interrupt Switching Characteristics
      8. 4.7.8 Low-Power Modes
        1. 4.7.8.1 Clock-Gating Low-Power Modes
        2. 4.7.8.2 Power-Gating Low-Power Modes
        3. 4.7.8.3 Low-Power Mode Wakeup Timing
          1. Table 4-29 IDLE Mode Timing Requirements
          2. Table 4-30 IDLE Mode Switching Characteristics
          3. Table 4-31 STANDBY Mode Timing Requirements
          4. Table 4-32 STANDBY Mode Switching Characteristics
          5. Table 4-33 HALT Mode Timing Requirements
          6. Table 4-34 HALT Mode Switching Characteristics
          7. Table 4-35 HIBERNATE Mode Timing Requirements
          8. Table 4-36 HIBERNATE Mode Switching Characteristics
      9. 4.7.9 External Memory Interface (EMIF)
        1. 4.7.9.1 Asynchronous Memory Support
        2. 4.7.9.2 Synchronous DRAM Support
        3. 4.7.9.3 EMIF Electrical Data and Timing
          1. 4.7.9.3.1 Asynchronous RAM
            1. Table 4-37 EMIF Asynchronous Memory Timing Requirements
            2. Table 4-38 EMIF Asynchronous Memory Switching Characteristics
          2. 4.7.9.3.2 Synchronous RAM
            1. Table 4-39 EMIF Synchronous Memory Timing Requirements
            2. Table 4-40 EMIF Synchronous Memory Switching Characteristics
    8. 4.8  Analog Peripherals
      1. 4.8.1 Analog-to-Digital Converter (ADC)
        1. 4.8.1.1 ADC Electrical Data and Timing
          1. Table 4-41 ADC Operating Conditions (16-Bit Differential Mode)
          2. Table 4-42 ADC Characteristics (16-Bit Differential Mode)
          3. Table 4-43 ADC Operating Conditions (12-Bit Single-Ended Mode)
          4. Table 4-44 ADC Characteristics (12-Bit Single-Ended Mode)
          5. Table 4-45 ADCEXTSOC Timing Requirements
          6. 4.8.1.1.1   ADC Input Models
            1. Table 4-46 Single-Ended Input Model Parameters
            2. Table 4-47 Differential Input Model Parameters
          7. 4.8.1.1.2   ADC Timing Diagrams
            1. Table 4-49 ADC Timings in 12-Bit Mode (SYSCLK Cycles)
            2. Table 4-50 ADC Timings in 16-Bit Mode
        2. 4.8.1.2 Temperature Sensor Electrical Data and Timing
          1. Table 4-51 Temperature Sensor Electrical Characteristics
      2. 4.8.2 Comparator Subsystem (CMPSS)
        1. 4.8.2.1 CMPSS Electrical Data and Timing
          1. Table 4-52 Comparator Electrical Characteristics
          2. Table 4-53 CMPSS DAC Static Electrical Characteristics
      3. 4.8.3 Buffered Digital-to-Analog Converter (DAC)
        1. 4.8.3.1 Buffered DAC Electrical Data and Timing
          1. Table 4-54 Buffered DAC Electrical Characteristics
    9. 4.9  Control Peripherals
      1. 4.9.1 Enhanced Capture (eCAP)
        1. 4.9.1.1 eCAP Electrical Data and Timing
          1. Table 4-55 eCAP Timing Requirement
          2. Table 4-56 eCAP Switching Characteristics
      2. 4.9.2 Enhanced Pulse Width Modulator (ePWM)
        1. 4.9.2.1 Control Peripherals Synchronization
        2. 4.9.2.2 ePWM Electrical Data and Timing
          1. Table 4-57 ePWM Timing Requirements
          2. Table 4-58 ePWM Switching Characteristics
          3. 4.9.2.2.1   Trip-Zone Input Timing
            1. Table 4-59 Trip-Zone Input Timing Requirements
        3. 4.9.2.3 External ADC Start-of-Conversion Electrical Data and Timing
          1. Table 4-60 External ADC Start-of-Conversion Switching Characteristics
      3. 4.9.3 Enhanced Quadrature Encoder Pulse (eQEP)
        1. 4.9.3.1 eQEP Electrical Data and Timing
          1. Table 4-61 eQEP Timing Requirements
          2. Table 4-62 eQEP Switching Characteristics
      4. 4.9.4 High-Resolution Pulse Width Modulator (HRPWM)
        1. 4.9.4.1 HRPWM Electrical Data and Timing
          1. Table 4-63 High-Resolution PWM Characteristics
      5. 4.9.5 Sigma-Delta Filter Module (SDFM)
        1. 4.9.5.1 SDFM Electrical Data and Timing
          1. Table 4-64 SDFM Timing Requirements
    10. 4.10 Communications Peripherals
      1. 4.10.1 Controller Area Network (CAN)
      2. 4.10.2 Inter-Integrated Circuit (I2C)
        1. 4.10.2.1 I2C Electrical Data and Timing
          1. Table 4-65 I2C Timing Requirements
          2. Table 4-66 I2C Switching Characteristics
      3. 4.10.3 Multichannel Buffered Serial Port (McBSP)
        1. 4.10.3.1 McBSP Electrical Data and Timing
          1. 4.10.3.1.1 McBSP Transmit and Receive Timing
            1. Table 4-67 McBSP Timing Requirements
            2. Table 4-68 McBSP Switching Characteristics
          2. 4.10.3.1.2 McBSP as SPI Master or Slave Timing
            1. Table 4-69 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. Table 4-70 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. Table 4-71 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. Table 4-72 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. Table 4-73 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. Table 4-74 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. Table 4-75 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. Table 4-76 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      4. 4.10.4 Serial Communications Interface (SCI)
      5. 4.10.5 Serial Peripheral Interface (SPI)
        1. 4.10.5.1 SPI Electrical Data and Timing
          1. 4.10.5.1.1 Non-High-Speed Master Mode Timings
            1. Table 4-77 SPI Master Mode Switching Characteristics (Clock Phase = 0)
            2. Table 4-78 SPI Master Mode Switching Characteristics (Clock Phase = 1)
            3. Table 4-79 SPI Master Mode Timing Requirements
          2. 4.10.5.1.2 Non-High-Speed Slave Mode Timings
            1. Table 4-80 SPI Slave Mode Switching Characteristics
            2. Table 4-81 SPI Slave Mode Timing Requirements
          3. 4.10.5.1.3 High-Speed Master Mode Timings
            1. Table 4-82 SPI High-Speed Master Mode Switching Characteristics (Clock Phase = 0)
            2. Table 4-83 SPI High-Speed Master Mode Switching Characteristics (Clock Phase = 1)
            3. Table 4-84 SPI High-Speed Master Mode Timing Requirements
          4. 4.10.5.1.4 High-Speed Slave Mode Timings
            1. Table 4-85 SPI High-Speed Slave Mode Switching Characteristics
            2. Table 4-86 SPI High-Speed Slave Mode Timing Requirements
      6. 4.10.6 Universal Serial Bus (USB) Controller
        1. 4.10.6.1 USB Electrical Data and Timing
          1. Table 4-87 USB Input Ports DP and DM Timing Requirements
          2. Table 4-88 USB Output Ports DP and DM Switching Characteristics
      7. 4.10.7 Universal Parallel Port (uPP) Interface
        1. 4.10.7.1 uPP Electrical Data and Timing
          1. Table 4-89 uPP Timing Requirements
          2. Table 4-90 uPP Switching Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Memory
      1. 5.3.1 C28x Memory Map
      2. 5.3.2 Flash Memory Map
      3. 5.3.3 EMIF Chip Select Memory Map
      4. 5.3.4 Peripheral Registers Memory Map
      5. 5.3.5 Memory Types
        1. 5.3.5.1 Dedicated RAM (Mx and Dx RAM)
        2. 5.3.5.2 Local Shared RAM (LSx RAM)
        3. 5.3.5.3 Global Shared RAM (GSx RAM)
        4. 5.3.5.4 CPU Message RAM (CPU MSGRAM)
        5. 5.3.5.5 CLA Message RAM (CLA MSGRAM)
    4. 5.4  Identification
    5. 5.5  Bus Architecture – Peripheral Connectivity
    6. 5.6  C28x Processor
      1. 5.6.1 Floating-Point Unit
      2. 5.6.2 Trigonometric Math Unit
      3. 5.6.3 Viterbi, Complex Math, and CRC Unit II (VCU-II)
    7. 5.7  Control Law Accelerator
    8. 5.8  Direct Memory Access
    9. 5.9  Interprocessor Communication Module
    10. 5.10 Boot ROM and Peripheral Booting
      1. 5.10.1 EMU Boot or Emulation Boot
      2. 5.10.2 WAIT Boot Mode
      3. 5.10.3 Get Mode
      4. 5.10.4 Peripheral Pins Used by Bootloaders
    11. 5.11 Dual Code Security Module
    12. 5.12 Timers
    13. 5.13 Nonmaskable Interrupt With Watchdog Timer (NMIWD)
    14. 5.14 Watchdog
    15. 5.15 Configurable Logic Block (CLB)
  6. 6Applications, Implementation, and Layout
    1. 6.1 TI Design or Reference Design
  7. 7デバイスおよびドキュメントのサポート
    1. 7.1 デバイスおよび開発ツールの項目表記
    2. 7.2 ツールとソフトウェア
    3. 7.3 デバイスの項目表記
    4. 7.4 ドキュメントのサポート
    5. 7.5 Community Resources
    6. 7.6 商標
    7. 7.7 静電気放電に関する注意事項
    8. 7.8 Export Control Notice
    9. 7.9 Glossary
  8. 8メカニカル、パッケージ、および注文情報
    1. 8.1 ビア・チャネル
    2. 8.2 パッケージ情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3.1 C28x Memory Map

Both C28x CPUs on the device have the same memory map except where noted in Table 5-1. The GSx_RAM (Global Shared RAM) should be assigned to either CPU by the GSxMSEL register. Memories accessible by the CLA or DMA (direct memory access) are noted as well.

Table 5-1 C28x Memory Map

MEMORY SIZE START ADDRESS END ADDRESS CLA ACCESS DMA ACCESS
M0 RAM 1K × 16 0x0000 0000 0x0000 03FF
M1 RAM 1K × 16 0x0000 0400 0x0000 07FF
PieVectTable 512 × 16 0x0000 0D00 0x0000 0EFF
CPUx.CLA1 to CPUx MSGRAM 128 × 16 0x0000 1480 0x0000 14FF Yes
CPUx to CPUx.CLA1 MSGRAM 128 × 16 0x0000 1500 0x0000 157F Yes
UPP TX MSG RAM 512 × 16 0x0000 6C00 0x0000 6DFF Yes
UPP RX MSG RAM 512 × 16 0x0000 6E00 0x0000 6FFF Yes
LS0 RAM 2K × 16 0x0000 8000 0x0000 87FF Yes
LS1 RAM 2K × 16 0x0000 8800 0x0000 8FFF Yes
LS2 RAM 2K × 16 0x0000 9000 0x0000 97FF Yes
LS3 RAM 2K × 16 0x0000 9800 0x0000 9FFF Yes
LS4 RAM 2K × 16 0x0000 A000 0x0000 A7FF Yes
LS5 RAM 2K × 16 0x0000 A800 0x0000 AFFF Yes
D0 RAM 2K × 16 0x0000 B000 0x0000 B7FF
D1 RAM 2K × 16 0x0000 B800 0x0000 BFFF
GS0 RAM(1) 4K × 16 0x0000 C000 0x0000 CFFF Yes
GS1 RAM(1) 4K × 16 0x0000 D000 0x0000 DFFF Yes
GS2 RAM(1) 4K × 16 0x0000 E000 0x0000 EFFF Yes
GS3 RAM(1) 4K × 16 0x0000 F000 0x0000 FFFF Yes
GS4 RAM(1) 4K × 16 0x0001 0000 0x0001 0FFF Yes
GS5 RAM(1) 4K × 16 0x0001 1000 0x0001 1FFF Yes
GS6 RAM(1) 4K × 16 0x0001 2000 0x0001 2FFF Yes
GS7 RAM(1) 4K × 16 0x0001 3000 0x0001 3FFF Yes
GS8 RAM(1) 4K × 16 0x0001 4000 0x0001 4FFF Yes
GS9 RAM(1) 4K × 16 0x0001 5000 0x0001 5FFF Yes
GS10 RAM(1) 4K × 16 0x0001 6000 0x0001 6FFF Yes
GS11 RAM(1) 4K × 16 0x0001 7000 0x0001 7FFF Yes
GS12 RAM(1)(2) 4K × 16 0x0001 8000 0x0001 8FFF Yes
GS13 RAM(1)(2) 4K × 16 0x0001 9000 0x0001 9FFF Yes
GS14 RAM(1)(2) 4K × 16 0x0001 A000 0x0001 AFFF Yes
GS15 RAM(1)(2) 4K × 16 0x0001 B000 0x0001 BFFF Yes
CPU2 to CPU1 MSGRAM(1) 1K × 16 0x0003 F800 0x0003 FBFF Yes
CPU1 to CPU2 MSGRAM(1) 1K × 16 0x0003 FC00 0x0003 FFFF Yes
CAN A Message RAM(1) 2K × 16 0x0004 9000 0x0004 97FF
CAN B Message RAM(1) 2K × 16 0x0004 B000 0x0004 B7FF
Flash 256K × 16 0x0008 0000 0x000B FFFF
Secure ROM 32K × 16 0x003F 0000 0x003F 7FFF
Boot ROM 32K × 16 0x003F 8000 0x003F FFBF
Vectors 64 × 16 0x003F FFC0 0x003F FFFF
(1) Shared between CPU subsystems.
(2) Available only on F28379D, F28378D, F28377D, and F28375D.