SPNS141G August   2010  – October 2018 TMS570LS10106 , TMS570LS10116 , TMS570LS10206 , TMS570LS20206 , TMS570LS20216

PRODUCTION DATA.  

  1. 1 TMS570LS Series 16/32-BIT RISC Flash Microcontroller
    1. 1.1 Features
    2. 1.2 Description
    3. 1.3 Functional Block Diagram
  2. 2 Device Overview
    1. 2.1 Terms and Acronyms
    2. 2.2 Device Characteristics
    3. 2.3 Memory
      1. 2.3.1 Memory Map
      2. 2.3.2 Flash Memory
      3. 2.3.3 System Modules Assignment
      4. 2.3.4 Peripheral Selects
      5. 2.3.5 Memory Auto-Initialization
      6. 2.3.6 PBIST RAM Self Test
    4. 2.4 Pin Assignments
      1. 2.4.1 PGE QFP Package Pinout (144 pin)
      2. 2.4.2 ZWT BGA Package Pinout (337 ball)
    5. 2.5 Terminal Functions
    6. 2.6 Device Support
      1. 2.6.1 Device and Development-Support Tool Nomenclature
  3. 3 Reset / Abort Sources
    1. 3.1 Reset / Abort Sources
  4. 4 Peripherals
    1. 4.1  Error Signaling Module (ESM)
    2. 4.2  Direct Memory Access (DMA)
    3. 4.3  High End Timer Transfer Unit (HET-TU)
    4. 4.4  Vectored Interrupt Manager (VIM)
    5. 4.5  MIBADC Event Trigger Sources
    6. 4.6  MIBSPI
      1. 4.6.1 MIBSPI Event Trigger Sources
      2. 4.6.2 MIBSPIP5/DMM Pin Multiplexing
    7. 4.7  ETM
    8. 4.8  Debug Scan Chains
      1. 4.8.1 JTAG
    9. 4.9  CCM
      1. 4.9.1 Dual Core Implementation
      2. 4.9.2 CCM-R4
    10. 4.10 LPM
    11. 4.11 Voltage Monitor
    12. 4.12 CRC
    13. 4.13 System Module Access
    14. 4.14 Debug ROM
    15. 4.15 CPU Self Test Controller: STC / LBIST
  5. 5 Device Registers
    1. 5.1 Device Identification Code Register
      1. Table 5-1 Device ID Bit Allocation Register Field Descriptions
    2. 5.2 Die-ID Registers
    3. 5.3 PLL Registers
  6. 6 Device Electrical Specifications
    1. 7 Operating Conditions
      1. 7.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
      2. 7.2 Device Recommended Operating Conditions
      3. 7.3 Electrical Characteristics Over Operating Free-Air Temperature Range
  7. 8 Peripheral and Electrical Specifications
    1. 8.1  Clocks
      1. 8.1.1 PLL And Clock Specifications
      2. 8.1.2 External Reference Resonator/Crystal Oscillator Clock Option
      3. 8.1.3 Validated FMPLL Setting
      4. 8.1.4 LPO And Clock Detection
      5. 8.1.5 Switching Characteristics Over Recommended Operating Conditions For Clocks
        1. 8.1.5.1 Timing - Wait States
    2. 8.2  ECLK Specification
      1. 8.2.1 Switching Characteristics Over Recommended Operating Conditions For External Clocks
    3. 8.3  RST And PORRST Timings
      1. 8.3.1 Timing Requirements For PORRST
      2. 8.3.2 Switching Characteristics Over Recommended Operating Conditions For RST
      3. 8.3.3 IO Status During PORRST
    4. 8.4  TEST Pin Timing
    5. 8.5  DAP - JTAG Scan Interface Timing
      1. 8.5.1 JTAG clock specification 12-MHz and 50-pF load on TDO output
    6. 8.6  Output Timings
      1. 8.6.1 Switching Characteristics For Output Timings Versus Load Capacitance (CL)
    7. 8.7  Input Timings
      1. 8.7.1 Timing Requirements For Input Timings
    8. 8.8  Flash Timings
    9. 8.9  SPI Master Mode Timing Parameters
      1. 8.9.1 SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
      2. 8.9.2 SPI Master Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
    10. 8.10 SPI Slave Mode Timing Parameters
      1. 8.10.1 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO = input, and SPISOMI = output)
      2. 8.10.2 SPI Slave Mode External Timing Parameters (CLOCK PHASE = 1, SPICLK = input, SPISIMO = input, and SPISOMI = output)
    11. 8.11 CAN Controller Mode Timings
      1. 8.11.1 Dynamic Characteristics For The CANnTX And CANnRX Pins
    12. 8.12 SCI/LIN Mode Timings
    13. 8.13 FlexRay Controller Mode Timings
      1. 8.13.1 Jitter Timing
    14. 8.14 EMIF Timings
      1. 8.14.1 Read Timing (Asynchronous RAM)
      2. 8.14.2 Write Timing (Asynchronous RAM)
    15. 8.15 ETM Timings
      1. 8.15.1 ETMTRACECLK Timing
      2. 8.15.2 ETMDATA Timing
    16. 8.16 RTP Timings
      1. 8.16.1 RTPCLK Timing
      2. 8.16.2 RTPDATA Timing
      3. 8.16.3 RTPENABLE Timing
    17. 8.17 DMM Timings
      1. 8.17.1 DMMCLK Timing
      2. 8.17.2 DMMDATA Timing
      3. 8.17.3 DMMENA Timing
    18. 8.18 MibADC
      1. 8.18.1 MibADC
      2. 8.18.2 MibADC Recommended Operating Conditions
      3. 8.18.3 Operating Characteristics Over Full Ranges Of Recommended Operating Conditions
      4. 8.18.4 MibADC Input Model
      5. 8.18.5 MibADC Timings
      6. 8.18.6 MibADC Nonlinearity Error
      7. 8.18.7 MibADC Total Error
  8. 9 Revision History
  9. 10Mechanical Packaging and Orderable Information
    1. 10.1 Thermal Data
      1. 10.1.1 PGE (S-PQFP-G144) plastic Quad Flat Pack
      2. 10.1.2 ZWT (S-PBGA-N337) Plastic ball grid array
    2. 10.2 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZWT|337
サーマルパッド・メカニカル・データ
発注情報

8.8 Flash Timings

Table 8-12 Timing Requirements For Program Flash

MIN NOM MAX Unit
tprog(32-bit) Full word (32-bit) programming time 33 300 µs
tprog(Total) 2M-byte programming time(1) -40°C to 125°C 17 74 s
0°C to 60°C, for first 25 cycles 17 25 s
tprog ECC(16-bit) ECC programming time 33 300 µs
tprog ECC(total) Total ECC bit programming time (256k-byte) -40°C to 125°C 4.3 15 s
0°C to 60°C, for first 25 cycles 4.3 7 s
terase(sector) Sector erase time (including compaction) -40°C to 125°C 2 15 s
0°C to 60°C, for first 25 cycles 1.5 10 s
terase(bank) Bank erase time (including compaction),0°C to 60°C, for first 25 cycles Bank 0 7.5 20 s
Bank 1 5.5 12 s
Bank 2 5.5 12 s
Bank 3 5.5 12 s
twec Write/erase cycles at TA = -40 to 125°C with 15 year Data Retention requirement(2) 1000 cycles
(1) This programming time includes overhead of state machine, but does not include data transfer time.
(2) Flash write/erase cycles and data retention specifications are based on a validated implementation of the TI flash API. Non-TI flash API implementation is not supported. For detailed description see the F035Flash Validation Procedure (SPNA127).