JAJSGN7A December   2018  – February 2024 TMUX1109

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (VDD = 5V ±10 %)
    6. 5.6 Electrical Characteristics (VDD = 3.3V ±10 %)
    7. 5.7 Electrical Characteristics (VDD = 2.5V ±10 %), (VSS = –2.5V ±10 %)
    8. 5.8 Electrical Characteristics (VDD = 1.8V ±10 %)
    9. 5.9 Electrical Characteristics (VDD = 1.2V ±10 %)
    10.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
      1. 6.1.1  On-Resistance
      2. 6.1.2  Off-Leakage Current
      3. 6.1.3  On-Leakage Current
      4. 6.1.4  Transition Time
      5. 6.1.5  Break-Before-Make
      6. 6.1.6  tON(EN) and tOFF(EN)
      7. 6.1.7  Charge Injection
      8. 6.1.8  Off Isolation
      9. 6.1.9  Crosstalk
      10. 6.1.10 Bandwidth
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Bidirectional Operation
      2. 6.3.2 Rail to Rail Operation
      3. 6.3.3 1.8V Logic Compatible Inputs
      4. 6.3.4 Fail-Safe Logic
      5. 6.3.5 Ultra-Low Leakage Current
      6. 6.3.6 Ultra-Low Charge Injection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Truth Tables
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|16
  • RSV|16
サーマルパッド・メカニカル・データ
発注情報

7.3 Power Supply Recommendations

The TMUX1109 operates across a wide supply range of 1.08V to 5.5V, or ±2.5V. Do not exceed the absolute maximum ratings because stresses beyond the listed ratings can cause permanent damage to the devices.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD and VSS supplies to other components. Good power-supply decoupling is important to achieve optimum performance. For improved supply noise immunity, use a supply decoupling capacitor ranging from 0.1μF to 10μF from VDD and VSS to ground. Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground planes.