To ensure reliability of the device, the following commonly used printed circuit board layout guidelines are recommended:

• Use decoupling capacitors between power supply pin and ground pin to ensure low impedance to reduce noise. To achieve a low impedance over a wide frequency range use capacitors with a high self-resonance frequency.
• Place ESD and EMI protection devices (if used) as close as possible to the connector.
• Use short trace lengths to avoid excessive loading.
• Keep traces at least two times the trace width apart to minimize the effects of crosstalk on adjacent traces.
• Separate high-speed signals from low-speed signals and digital from analog signals
• Avoid right-angle bends in a trace and try to route them at least with two 45° corners.
• Route the high-speed differential signal traces parallel to each other as much as possible. The traces are recommended to be symmetrical.
• Place a solid ground plane next to the high-speed signal layer. This also provides an excellent low-inductance path for the return current flow.