The TMUXS7614D device operates across a wide supply range of ±4.5V to ±25V (4.5V to 42V in single-supply mode). The device also perform well with asymmetrical supplies such as V_DD = 12V and V_SS = –5V.

Power-supply bypassing improves noise margin and prevents switching noise propagation from the supply rails to other components. Good power-supply decoupling is important to achieve optimum performance. TMUXS7614D integrates supply decoupling capacitors so external supply decoupling capacitors at both the V_DD, V_L, V_SS pins to ground are unnecessary. If the application needs additional bypass capacitors place them as close to the power supply pins of the device as possible using low-impedance connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall inductance and is beneficial for connections to ground and power planes. Always ensure the ground (GND) connection is established before supplies are ramped.