SLOS474E August 2005 – March 2016 TPA2005D1-Q1
PRODUCTION DATA.
Place all the external components very close to the TPA2005D1-Q1 device. The input resistors need to be very close to the TPA2005D1-Q1 input pins so noise does not couple on the high-impedance nodes between the input resistors and the input amplifier of the TPA2005D1-Q1 device. Placing the decoupling capacitor, CS, close to the TPA2005D1-Q1 device is important for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.
Make the high current traces going to pins VDD, GND, VO+ and VO– of the TPA2005D1-Q1 device have a minimum width of 0.7 mm. If these traces are too thin, the TPA2005D1-Q1 performance and output power will decrease. The input traces do not need to be wide, but do need to run side-by-side to enable common-mode noise cancellation.
Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the package.