SLOS524E June   2008  – May 2016 TPA2016D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Timing Requirements
    7. 7.7 Dissipation Ratings
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Operation With DACs and CODECs
      2. 9.3.2 Filter-Free Operation and Ferrite Bead Filters
      3. 9.3.3 Short-Circuit Protection
      4. 9.3.4 Automatic Gain Control
        1. 9.3.4.1 Fixed Gain
        2. 9.3.4.2 Limiter Level
        3. 9.3.4.3 Compression Ratio
        4. 9.3.4.4 Interaction Between Compression Ratio and Limiter Range
        5. 9.3.4.5 Noise Gate Threshold
        6. 9.3.4.6 Maximum Gain
        7. 9.3.4.7 Attack, Release, and Hold Time
    4. 9.4 Device Functional Modes
      1. 9.4.1 TPA2016D2 AGC Operation
      2. 9.4.2 TPA2016D2 AGC Recommended Settings
    5. 9.5 Programming
      1. 9.5.1 General I2C Operation
      2. 9.5.2 Single- and Multiple-Byte Transfers
      3. 9.5.3 Single-Byte Write
      4. 9.5.4 Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 9.5.5 Single-Byte Read
      6. 9.5.6 Multiple-Byte Read
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2016D2 With Differential Input Signal
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Surface Mount Capacitors
          2. 10.2.1.2.2 Decoupling Capacitor, CS
          3. 10.2.1.2.3 Input Capacitors, CI
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2016D2 With Single-Ended Input Signal
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Location
      2. 12.1.2 Trace Width
      3. 12.1.3 Pad Side
    2. 12.2 Layout Examples
    3. 12.3 Efficiency and Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

10.1 Application Information

These typical connection diagrams highlight the required external components and system level connections for proper operation of the device. Each of these configurations can be realized using the Evaluation Modules (EVMs) for the device. These flexible modules allow full evaluation of the device in the most common modes of operation. Any design variation can be supported by TI through schematic and layout reviews. Visit e2e.ti.com for design assistance and join the audio amplifier discussion forum for additional information.

10.2 Typical Applications

10.2.1 TPA2016D2 With Differential Input Signal

TPA2016D2 Differential_app.gif Figure 43. Typical Application Schematic With Differential Input Signals

10.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 12.

Table 12. Design Parameters

PARAMETER EXAMPLE VALUE
Power supply 5 V
Enable inputs High > 1.3 V
Low < 0.6 V
Speaker 8 Ω

10.2.1.2 Detailed Design Procedure

10.2.1.2.1 Surface Mount Capacitors

Temperature and applied DC voltage influence the actual capacitance of high-K materials. Table 13 shows the relationship between the different types of high-K materials and their associated tolerances, temperature coefficients, and temperature ranges. Notice that a capacitor made with X5R material can lose up to 15% of its capacitance within its working temperature range.

In an application, the working capacitance of components made with high-K materials is generally much lower than nominal capacitance. A worst-case result with a typical X5R material might be –10% tolerance, –15% temperature effect, and –45% DC voltage effect at 50% of the rated voltage. This particular case would result in a working capacitance of 42% (0.9 × 0.85 × 0.55) of the nominal value.

Select high-K ceramic capacitors according to the following rules:

  1. Use capacitors made of materials with temperature coefficients of X5R, X7R, or better.
  2. Use capacitors with DC voltage ratings of at least twice the application voltage. Use minimum 10-V capacitors for the TPA2016D2.
  3. Choose a capacitance value at least twice the nominal value calculated for the application. Multiply the nominal value by a factor of 2 for safety. If a 10-μF capacitor is required, use 20 µF.

The preceding rules and recommendations apply to capacitors used in connection with the TPA2016D2. The TPA2016D2 cannot meet its performance specifications if the rules and recommendations are not followed.

Table 13. Typical Tolerance and Temperature Coefficient of Capacitance by Material

MATERIAL COG/NPO X7R X5R
Typical tolerance ±5% ±10% 80 / –20%
Temperature ±30 ppm ±15% 22 / –82%
Temperature range, °C –55 to 125°C –55 to 125°C –30 to 85°C

10.2.1.2.2 Decoupling Capacitor, CS

The TPA2016D2 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) 1-μF ceramic capacitor (typically) placed as close as possible to the device PVDD (L, R) lead works best. Placing this decoupling capacitor close to the TPA2016D2 is important for the efficiency of the Class-D amplifier, because any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. For filtering lower-frequency noise signals, a 4.7-μF or greater capacitor placed near the audio power amplifier would also help, but it is not required in most applications because of the high PSRR of this device.

10.2.1.2.3 Input Capacitors, CI

The input capacitors and input resistors form a high-pass filter with the corner frequency, fC, determined in Equation 5.

Equation 5. TPA2016D2 q1_los524.gif

The value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. Speakers in wireless phones cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies in this application. Not using input capacitors can increase output offset. Equation 6 is used to solve for the input coupling capacitance. If the corner frequency is within the audio band, the capacitors must have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below.

Equation 6. TPA2016D2 q2_los524.gif

10.2.1.3 Application Curves

For application curves, see the figures listed in Table 14.

Table 14. Table of Graphs

DESCRIPTION FIGURE NUMBER
Output Level vs Input Level Figure 5
THD+N vs Frequency Figure 10
THD+N vs Output Power Figure 13
Output Power vs Supply Voltage Figure 21

10.2.2 TPA2016D2 With Single-Ended Input Signal

TPA2016D2 Single_Ended_app.gif Figure 44. Typical Application Schematic With Single-Ended Input Signal

10.2.2.1 Design Requirements

For this design example, use the parameters listed in Table 12.

10.2.2.2 Detailed Design Procedure

For the design procedure see Detailed Design Procedure.

10.2.2.3 Application Curves

For application curves, see the figures listed in Table 14.