SLVSC54B July 2013 – April 2014 TPD4E110
PRODUCTION DATA.
PCB manufacturing technologies allowing 2.8 mil (0.071 mm) clearances can route two Super-Speed data line pairs through TPD4E110 on a single layer.
In Figure 15, Figure 16 and Figure 17 an example layout shows the use of two TPD4E110s to protect the USB 3.0 port. TPD4E110 Number 1 is protecting the two Super-Speed data pairs used for Super Speed data transfer, and TPD4E110 Number 2 protects the USB 2.0 D+/D– Hi-Speed data lines. Number 2 uses two channels to protect each line in the pair, thus affording a more robust protection and simpler layout.
PCB manufacturing technologies allowing 4.0 mil (0.1 mm) clearances can route two Super-Speed data line pairs through TPD4E110 using two layers.
In Figure 18 an example layout shows the use of two TPD4E110s to protect the USB 3.0 port. TPD4E110 Number 1 is protecting the two Super-Speed data pairs used for high speed data transfer, and TPD4E110 Number 2 protects the USB 2.0 D+/D– Hi-Speed lines. Number 2 uses two channels to protect each line in the pair, thus affording a more robust protection and simpler layout.