JAJSPX1G January   2008  – June 2024 TPS2062A , TPS2066A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Parameter Measurement Information
    1.     13
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Overcurrent
      1. 7.3.1 Overcurrent Conditions (TPS2062ADRB, TPS2066ADRB, and TPS2066AD)
      2. 7.3.2 Overcurrent Conditions (TPS2062AD)
    4. 7.4 OCx Response
    5. 7.5 Undervoltage Lockout (UVLO)
    6. 7.6 Enable ( ENx or ENx)
    7. 7.7 Thermal Sense
  9. 8 Application Information
    1. 8.1 Power-Supply Considerations
    2. 8.2 Input and Output Capacitance
    3. 8.3 Power Dissipation and Junction Temperature
    4. 8.4 Universal Serial Bus (USB) Applications
    5. 8.5 Self-powered and Bus-Powered Hubs
    6. 8.6 Low-Power Bus-Powered And High-Power Bus-Powered Functions
    7. 8.7 USB Power-Distribution Requirements
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC(1) D
(SOIC)		 DRB
(SON)		 UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 119.3 47.5 °C/W°
RθJC(top) Junction-to-case (top) thermal resistance 67.6 53
RθJB Junction-to-board thermal resistance 59.6 14.2
ψJT Junction-to-top characterization parameter 20.3 1.2
ψJB Junction-to-board characterization parameter 59.1 14.2
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 7.3
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.