JAJSN99A December   2022  – September 2023 TPS25772-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Recommended Components
    5. 7.5  Thermal Information
    6. 7.6  Buck-Boost Regulator
    7. 7.7  CC Cable Detection Parameters
    8. 7.8  CC VCONN Parameters
    9. 7.9  CC PHY Parameters
    10. 7.10 Thermal Shutdown Characteristics
    11. 7.11 Oscillator Characteristics
    12. 7.12 ADC Characteristics
    13. 7.13 TVS Parameters
    14. 7.14 Input/Output (I/O) Characteristics
    15. 7.15 BC1.2 Characteristics
    16. 7.16 I2C Requirements and Characteristics
    17. 7.17 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Device Power Management and Supervisory Circuitry
        1. 9.3.1.1 VIN UVLO and Enable/UVLO
        2. 9.3.1.2 Internal LDO Regulators
      2. 9.3.2  TVSP Device Configuration and ESD Protection
      3. 9.3.3  Buck-Boost Regulator
        1. 9.3.3.1  Buck-Boost Regulator Operation
        2. 9.3.3.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 9.3.3.3  VIN Supply and VIN Over-Voltage Protection
        4. 9.3.3.4  Feedback Paths and Error Amplifiers
        5. 9.3.3.5  Transconductors and Compensation
        6. 9.3.3.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 9.3.3.7  VBUS Overvoltage Protection
        8. 9.3.3.8  VBUS Undervoltage Protection
        9. 9.3.3.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 9.3.3.10 Buck-Boost Peak Current Limits
      4. 9.3.4  USB-PD Physical Layer
        1. 9.3.4.1 USB-PD Encoding and Signaling
        2. 9.3.4.2 USB-PD Bi-Phase Marked Coding
        3. 9.3.4.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 9.3.4.4 USB-PD BMC Transmitter
        5. 9.3.4.5 USB-PD BMC Receiver
        6. 9.3.4.6 Squelch Receiver
      5. 9.3.5  VCONN
      6. 9.3.6  Cable Plug and Orientation Detection
        1. 9.3.6.1 Configured as a Source
        2. 9.3.6.2 Configured as a Sink
        3. 9.3.6.3 Overvoltage Protection (Px_CC1, Px_CC2)
      7. 9.3.7  ADC
        1. 9.3.7.1 ADC Divider Ratios
      8. 9.3.8  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      9. 9.3.9  USB2.0 Low-Speed Endpoint
      10. 9.3.10 Digital Interfaces
        1. 9.3.10.1 General GPIO
        2. 9.3.10.2 I2C Buffer
      11. 9.3.11 I2C Interface
        1. 9.3.11.1 I2C Interface Description
        2. 9.3.11.2 I2C Clock Stretching
        3. 9.3.11.3 I2C Address Setting
        4. 9.3.11.4 Unique Address Interface
        5. 9.3.11.5 I2C Pullup Resistor Calculation
      12. 9.3.12 Digital Core
        1. 9.3.12.1 Device Memory
        2. 9.3.12.2 Core Microprocessor
      13. 9.3.13 NTC Input
      14. 9.3.14 Thermal Sensors and Thermal Shutdown
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Application GUI Selections
        2. 10.2.2.2 EEPROM Selection
        3. 10.2.2.3 EN/UVLO
        4. 10.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 10.2.2.5 Inductor Currents
        6. 10.2.2.6 Output Capacitor
        7. 10.2.2.7 Input Capacitor
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.9 CC PHY Parameters

Typical values correspond to TJ = 25°C. Minimum and maximum limits apply over the –40°C to 150°C junction temperature range unless otherwise stated.VIN = 13.5 V, EN = 2V unless otherwise stated.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Transmitter
VTXHI Transmit high voltage on Px_CCy Standard External load 1.05 1.125 1.2 V
VTXLO Transmit low voltage on Px_CCy Standard External load -75 75 mV
ZDRIVER Transmit output impedance while driving the CC line using Px_CCy measured at 750 kHz 33 75 Ω
tRise Rise time. 10 % to 90 % amplitude points on Px_CCy, minimum is under an unloaded condition. Maximum set by TX mask CPx_CCy= 520 pF 300 ns
tFall Fall time. 90 % to 10 % amplitude points on Px_CCy, minimum is under an unloaded condition. Maximum set by TX mask CPx_CCy= 520 pF 300 ns
VPHY_OVP OVP detection threshold for USB PD PHY. Initially VCC1 ≤ 5.5 V and VCC2 ≤ 5.5 V, then VCCx rises. 5.5 8.5 V
Receiver
ZBMCRX (2) Receiver input impedance on Px_CCy Does not include pull-up or pulldown resistance from cable detect. Transmitter is Hi-Z. 1 MΩ
CCC Receiver capacitance on Px_CCy(1) Capacitance looking into the CC pin when in receiver mode 120 pF
VRX_SNK_R Rising threshold on Px_CCy for receiver comparator sink mode (rising) 499 525 551 mV
VRX_SRC_R Rising threshold on Px_CCy for receiver comparator source mode (rising) 784 825 866 mV
VRX_SNK_F Falling threshold on Px_CCy for receiver comparator sink mode (falling) 230 250 270 mV
VRX_SRC_F Falling threshold on Px_CCy for receiver comparator source mode (falling) 523 550 578 mV
(1) CCC includes only the internal capacitance on a Px_CCy pin when the pin is configured to be receiving BMC data. External capacitance is needed to meet the required minimum capacitance per the USB-PD Specifications (cReceiver). Therefore, TI recommends adding CPx_CCy externally.
(2) Guaranteed, but not production tested.