JAJSMF5B september   2022  – june 2023 TPS25990

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 概要 (続き)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Logic Interface DC Characteristics
    7. 7.7  Telemetry
    8. 7.8  PMBus Interface Timing Characteristics
    9. 7.9  External EEPROM Interface Timing Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Timeout
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Single Point Failure Mitigation
        1. 8.3.5.1 IMON Pin Single Point Failure
        2. 8.3.5.2 ILIM Pin Single Point Failure
        3. 8.3.5.3 IREF Pin Single Point Failure
      6. 8.3.6  Analog Load Current Monitor (IMON)
      7. 8.3.7  Overtemperature Protection
      8. 8.3.8  Analog Junction Temperature Monitor (TEMP)
      9. 8.3.9  FET Health Monitoring
      10. 8.3.10 General Purpose Digital Input/Output Pins
        1. 8.3.10.1 Fault Response and Indication (FLT)
        2. 8.3.10.2 Power Good Indication (PG)
        3. 8.3.10.3 Parallel Device Synchronization (SWEN)
      11. 8.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.11.1 Current Balancing During Start-Up
      12. 8.3.12 General Purpose Comparators
      13. 8.3.13 Output Discharge
      14. 8.3.14 PMBus® Digital Interface
        1. 8.3.14.1  PMBus® Device Addressing
        2. 8.3.14.2  SMBus Protocol
        3. 8.3.14.3  SMBus™ Message Formats
        4. 8.3.14.4  Packet Error Checking
        5. 8.3.14.5  Group Commands
        6. 8.3.14.6  SMBus™ Alert Response Address (ARA)
        7. 8.3.14.7  PMBus® Commands
          1. 8.3.14.7.1 Detailed Descriptions of PMBus® Commands
            1. 8.3.14.7.1.1  OPERATION (01h, Read/Write Byte)
            2. 8.3.14.7.1.2  CLEAR_FAULTS (03h, Send Byte)
            3. 8.3.14.7.1.3  RESTORE_FACTORY_DEFAULTS (12h, Send Byte)
            4. 8.3.14.7.1.4  STORE_USER_ALL (15h, Send Byte)
            5. 8.3.14.7.1.5  RESTORE_USER_ALL (16h, Send Byte)
            6. 8.3.14.7.1.6  BB_ERASE (F5h, Send Byte)
            7. 8.3.14.7.1.7  FETCH_BB_EEPROM (F6h, Send Byte)
            8. 8.3.14.7.1.8  POWER_CYCLE (D9h, Send Byte)
            9. 8.3.14.7.1.9  MFR_WRITE_PROTECT (F8h, Read/Write Byte)
            10. 8.3.14.7.1.10 CAPABILITY (19h, Read Byte)
            11. 8.3.14.7.1.11 STATUS_BYTE (78h, Read Byte)
            12. 8.3.14.7.1.12 STATUS_WORD (79h, Read Word)
            13. 8.3.14.7.1.13 STATUS_OUT (7Ah, Read Byte)
            14. 8.3.14.7.1.14 STATUS_IOUT (7Bh, Read Byte)
            15. 8.3.14.7.1.15 STATUS_INPUT (7Ch, Read Byte)
            16. 8.3.14.7.1.16 STATUS_TEMP (7Dh, Read Byte)
            17. 8.3.14.7.1.17 STATUS_CML (7Eh, Read Byte)
            18. 8.3.14.7.1.18 STATUS_MFR_SPECIFIC (80h, Read Byte)
            19. 8.3.14.7.1.19 STATUS_MFR_SPECIFIC_2 (F3h, Read Word)
            20. 8.3.14.7.1.20 PMBUS_REVISION (98h, Read Byte)
            21. 8.3.14.7.1.21 MFR_ID (99h, Block Read)
            22. 8.3.14.7.1.22 MFR_MODEL (9Ah, Block Read)
            23. 8.3.14.7.1.23 MFR_REVISION (9Bh, Block Read)
            24. 8.3.14.7.1.24 READ_VIN (88h, Read Word)
            25. 8.3.14.7.1.25 READ_VOUT (8Bh, Read Word)
            26. 8.3.14.7.1.26 READ_IIN (89h, Read Word)
            27. 8.3.14.7.1.27 READ_TEMPERATURE_1 (8Dh, Read Word)
            28. 8.3.14.7.1.28 READ_VAUX (D0h, Read Word)
            29. 8.3.14.7.1.29 READ_PIN (97h, Read Word)
            30. 8.3.14.7.1.30 READ_EIN (86h, Block Read)
            31. 8.3.14.7.1.31 READ_VIN_AVG (DCh, Read Word)
            32. 8.3.14.7.1.32 READ_VIN_MIN (D1h, Read Word)
            33. 8.3.14.7.1.33 READ_VIN_PEAK (D2h, Read Word)
            34. 8.3.14.7.1.34 READ_VOUT_AVG (DDh, Read Word)
            35. 8.3.14.7.1.35 READ_VOUT_MIN (DAh, Read Word)
            36. 8.3.14.7.1.36 READ_IIN_AVG (DEh, Read Word)
            37. 8.3.14.7.1.37 READ_IIN_PEAK (D4h, Read Word)
            38. 8.3.14.7.1.38 READ_TEMP_AVG (D6h, Read Word)
            39. 8.3.14.7.1.39 READ_TEMP_PEAK (D7h, Read Word)
            40. 8.3.14.7.1.40 READ_PIN_AVG (DFh, Read Word)
            41. 8.3.14.7.1.41 READ_PIN_PEAK (D5h, Read Word)
            42. 8.3.14.7.1.42 READ_SAMPLE_BUF (D8h, Block Read)
            43. 8.3.14.7.1.43 READ_BB_RAM (FDh, Block Read)
            44. 8.3.14.7.1.44 READ_BB_EEPROM (F4h, Block Read)
            45. 8.3.14.7.1.45 BB_TIMER (FAh, Read Byte)
            46. 8.3.14.7.1.46 PMBUS_ADDR (FBh, Read/Write Byte)
            47. 8.3.14.7.1.47 VIN_UV_WARN (58h, Read/Write Word)
            48. 8.3.14.7.1.48 VIN_UV_FLT (59h, Read/Write Word)
            49. 8.3.14.7.1.49 VIN_OV_WARN (57h, Read/Write Word)
            50. 8.3.14.7.1.50 VIN_OV_FLT (55h, Read/Write Word)
            51. 8.3.14.7.1.51 VOUT_UV_WARN (43h, Read/Write Word)
            52. 8.3.14.7.1.52 VOUT_PGTH (5Fh, Read/Write Word)
            53. 8.3.14.7.1.53 OT_WARN (51h, Read/Write Word)
            54. 8.3.14.7.1.54 OT_FLT (4Fh, Read/Write Word)
            55. 8.3.14.7.1.55 PIN_OP_WARN (6Bh, Read/Write Word)
            56. 8.3.14.7.1.56 IIN_OC_WARN (5Dh, Read/Write Word)
            57. 8.3.14.7.1.57 VIREF (E0h, Read/Write Byte)
            58. 8.3.14.7.1.58 GPIO_CONFIG_12 (E1h, Read/Write Byte)
            59. 8.3.14.7.1.59 GPIO_CONFIG_34 (E2h, Read/Write Byte)
            60. 8.3.14.7.1.60 ALERT_MASK (DBh, Read/Write Word)
            61. 8.3.14.7.1.61 FAULT_MASK (E3h, Read/Write Word)
            62. 8.3.14.7.1.62 DEVICE_CONFIG (E4h, Read/Write Word)
            63. 8.3.14.7.1.63 BB_CONFIG (E5h, Read/Write Byte)
            64. 8.3.14.7.1.64 OC_TIMER (E6h, Read/Write Byte)
            65. 8.3.14.7.1.65 RETRY_CONFIG (E7h, Read/Write Byte)
            66. 8.3.14.7.1.66 ADC_CONFIG_1 (E8h, Read/Write Byte)
            67. 8.3.14.7.1.67 ADC_CONFIG_2 (E9h, Read/Write Byte)
            68. 8.3.14.7.1.68 PK_MIN_AVG (EAh, Read/Write Byte)
            69. 8.3.14.7.1.69 VCMPxREF (EBh, Read/Write Byte)
            70. 8.3.14.7.1.70 PSU_VOLTAGE (ECh, Read/Write Byte)
            71. 8.3.14.7.1.71 CABLE_DROP (EDh, Read/Write Byte)
            72. 8.3.14.7.1.72 GPDAC1 (F0h, Read/Write Byte)
            73. 8.3.14.7.1.73 GPDAC2 (F1h, Read/Write Byte)
            74. 8.3.14.7.1.74 INS_DLY (F9h, Read/Write Byte)
        8. 8.3.14.8  Analog-to-digital Converter
        9. 8.3.14.9  Digital-to-analog Converters
        10. 8.3.14.10 DIRECT format Conversion
        11. 8.3.14.11 Blackbox Fault Recording
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple Devices, Independent Operation (Multi-zone)
    2. 9.2 Typical Application: 12-V, 4-kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output Short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.4.1 Transient Protection

In the case of a short-circuit or circuit-breaker event, when the device interrupts current flow, the input inductance generates a positive voltage spike on the input, and the output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) is dependent on the value of inductance in series to the input or output of the device. Such transients can exceed the absolute maximum ratings of the device if steps are not taken to address the issue. Typical methods for addressing transients include:

  • Minimize lead length and inductance into and out of the device.
  • Use a large PCB GND plane.
  • Connect a Schottky diode from the OUT pin ground to absorb negative spikes.
  • Connect a low ESR capacitor of 2.2 μF or higher at the OUT pin very close to the device.
  • Connect a ceramic capacitor CIN = 0.1 μF or higher at the IN pin very close to the device to dampen the rise time of input transients. The capacitor voltage rating must be at least twice the input supply voltage to be able to withstand the positive voltage excursion during inductive ringing.

The approximate value of input capacitance can be estimated with Equation 44.

Equation 44. V S P I K E A b s o l u t e = V I N + I L O A D × L I N C I N

VIN is the nominal supply voltage.

ILOAD is the load current.

LIN equals the effective inductance seen looking into the source.

CIN is the capacitance present at the input.

  • Some applications can require the addition of a Transient Voltage Suppressor (TVS) to prevent transients from exceeding the absolute maximum ratings of the device. In some cases, even if the maximum amplitude of the transients is below the absolute maximum rating of the device, a TVS can help to absorb the excessive energy dump and prevent it from creating very fast transient voltages on the input supply pin of the IC, which can couple to the internal control circuits and cause unexpected behavior.

The circuit implementation with optional protection components is shown in Figure 9-18.

GUID-20220910-SS0I-G8GZ-HQXS-SVMPR5B49WWB-low.gif Figure 9-18 Circuit Implementation with Optional Protection Components