JAJSMF5B september   2022  – june 2023 TPS25990

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 概要 (続き)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Logic Interface DC Characteristics
    7. 7.7  Telemetry
    8. 7.8  PMBus Interface Timing Characteristics
    9. 7.9  External EEPROM Interface Timing Characteristics
    10. 7.10 Timing Requirements
    11. 7.11 Switching Characteristics
    12. 7.12 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Timeout
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Single Point Failure Mitigation
        1. 8.3.5.1 IMON Pin Single Point Failure
        2. 8.3.5.2 ILIM Pin Single Point Failure
        3. 8.3.5.3 IREF Pin Single Point Failure
      6. 8.3.6  Analog Load Current Monitor (IMON)
      7. 8.3.7  Overtemperature Protection
      8. 8.3.8  Analog Junction Temperature Monitor (TEMP)
      9. 8.3.9  FET Health Monitoring
      10. 8.3.10 General Purpose Digital Input/Output Pins
        1. 8.3.10.1 Fault Response and Indication (FLT)
        2. 8.3.10.2 Power Good Indication (PG)
        3. 8.3.10.3 Parallel Device Synchronization (SWEN)
      11. 8.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.11.1 Current Balancing During Start-Up
      12. 8.3.12 General Purpose Comparators
      13. 8.3.13 Output Discharge
      14. 8.3.14 PMBus® Digital Interface
        1. 8.3.14.1  PMBus® Device Addressing
        2. 8.3.14.2  SMBus Protocol
        3. 8.3.14.3  SMBus™ Message Formats
        4. 8.3.14.4  Packet Error Checking
        5. 8.3.14.5  Group Commands
        6. 8.3.14.6  SMBus™ Alert Response Address (ARA)
        7. 8.3.14.7  PMBus® Commands
          1. 8.3.14.7.1 Detailed Descriptions of PMBus® Commands
            1. 8.3.14.7.1.1  OPERATION (01h, Read/Write Byte)
            2. 8.3.14.7.1.2  CLEAR_FAULTS (03h, Send Byte)
            3. 8.3.14.7.1.3  RESTORE_FACTORY_DEFAULTS (12h, Send Byte)
            4. 8.3.14.7.1.4  STORE_USER_ALL (15h, Send Byte)
            5. 8.3.14.7.1.5  RESTORE_USER_ALL (16h, Send Byte)
            6. 8.3.14.7.1.6  BB_ERASE (F5h, Send Byte)
            7. 8.3.14.7.1.7  FETCH_BB_EEPROM (F6h, Send Byte)
            8. 8.3.14.7.1.8  POWER_CYCLE (D9h, Send Byte)
            9. 8.3.14.7.1.9  MFR_WRITE_PROTECT (F8h, Read/Write Byte)
            10. 8.3.14.7.1.10 CAPABILITY (19h, Read Byte)
            11. 8.3.14.7.1.11 STATUS_BYTE (78h, Read Byte)
            12. 8.3.14.7.1.12 STATUS_WORD (79h, Read Word)
            13. 8.3.14.7.1.13 STATUS_OUT (7Ah, Read Byte)
            14. 8.3.14.7.1.14 STATUS_IOUT (7Bh, Read Byte)
            15. 8.3.14.7.1.15 STATUS_INPUT (7Ch, Read Byte)
            16. 8.3.14.7.1.16 STATUS_TEMP (7Dh, Read Byte)
            17. 8.3.14.7.1.17 STATUS_CML (7Eh, Read Byte)
            18. 8.3.14.7.1.18 STATUS_MFR_SPECIFIC (80h, Read Byte)
            19. 8.3.14.7.1.19 STATUS_MFR_SPECIFIC_2 (F3h, Read Word)
            20. 8.3.14.7.1.20 PMBUS_REVISION (98h, Read Byte)
            21. 8.3.14.7.1.21 MFR_ID (99h, Block Read)
            22. 8.3.14.7.1.22 MFR_MODEL (9Ah, Block Read)
            23. 8.3.14.7.1.23 MFR_REVISION (9Bh, Block Read)
            24. 8.3.14.7.1.24 READ_VIN (88h, Read Word)
            25. 8.3.14.7.1.25 READ_VOUT (8Bh, Read Word)
            26. 8.3.14.7.1.26 READ_IIN (89h, Read Word)
            27. 8.3.14.7.1.27 READ_TEMPERATURE_1 (8Dh, Read Word)
            28. 8.3.14.7.1.28 READ_VAUX (D0h, Read Word)
            29. 8.3.14.7.1.29 READ_PIN (97h, Read Word)
            30. 8.3.14.7.1.30 READ_EIN (86h, Block Read)
            31. 8.3.14.7.1.31 READ_VIN_AVG (DCh, Read Word)
            32. 8.3.14.7.1.32 READ_VIN_MIN (D1h, Read Word)
            33. 8.3.14.7.1.33 READ_VIN_PEAK (D2h, Read Word)
            34. 8.3.14.7.1.34 READ_VOUT_AVG (DDh, Read Word)
            35. 8.3.14.7.1.35 READ_VOUT_MIN (DAh, Read Word)
            36. 8.3.14.7.1.36 READ_IIN_AVG (DEh, Read Word)
            37. 8.3.14.7.1.37 READ_IIN_PEAK (D4h, Read Word)
            38. 8.3.14.7.1.38 READ_TEMP_AVG (D6h, Read Word)
            39. 8.3.14.7.1.39 READ_TEMP_PEAK (D7h, Read Word)
            40. 8.3.14.7.1.40 READ_PIN_AVG (DFh, Read Word)
            41. 8.3.14.7.1.41 READ_PIN_PEAK (D5h, Read Word)
            42. 8.3.14.7.1.42 READ_SAMPLE_BUF (D8h, Block Read)
            43. 8.3.14.7.1.43 READ_BB_RAM (FDh, Block Read)
            44. 8.3.14.7.1.44 READ_BB_EEPROM (F4h, Block Read)
            45. 8.3.14.7.1.45 BB_TIMER (FAh, Read Byte)
            46. 8.3.14.7.1.46 PMBUS_ADDR (FBh, Read/Write Byte)
            47. 8.3.14.7.1.47 VIN_UV_WARN (58h, Read/Write Word)
            48. 8.3.14.7.1.48 VIN_UV_FLT (59h, Read/Write Word)
            49. 8.3.14.7.1.49 VIN_OV_WARN (57h, Read/Write Word)
            50. 8.3.14.7.1.50 VIN_OV_FLT (55h, Read/Write Word)
            51. 8.3.14.7.1.51 VOUT_UV_WARN (43h, Read/Write Word)
            52. 8.3.14.7.1.52 VOUT_PGTH (5Fh, Read/Write Word)
            53. 8.3.14.7.1.53 OT_WARN (51h, Read/Write Word)
            54. 8.3.14.7.1.54 OT_FLT (4Fh, Read/Write Word)
            55. 8.3.14.7.1.55 PIN_OP_WARN (6Bh, Read/Write Word)
            56. 8.3.14.7.1.56 IIN_OC_WARN (5Dh, Read/Write Word)
            57. 8.3.14.7.1.57 VIREF (E0h, Read/Write Byte)
            58. 8.3.14.7.1.58 GPIO_CONFIG_12 (E1h, Read/Write Byte)
            59. 8.3.14.7.1.59 GPIO_CONFIG_34 (E2h, Read/Write Byte)
            60. 8.3.14.7.1.60 ALERT_MASK (DBh, Read/Write Word)
            61. 8.3.14.7.1.61 FAULT_MASK (E3h, Read/Write Word)
            62. 8.3.14.7.1.62 DEVICE_CONFIG (E4h, Read/Write Word)
            63. 8.3.14.7.1.63 BB_CONFIG (E5h, Read/Write Byte)
            64. 8.3.14.7.1.64 OC_TIMER (E6h, Read/Write Byte)
            65. 8.3.14.7.1.65 RETRY_CONFIG (E7h, Read/Write Byte)
            66. 8.3.14.7.1.66 ADC_CONFIG_1 (E8h, Read/Write Byte)
            67. 8.3.14.7.1.67 ADC_CONFIG_2 (E9h, Read/Write Byte)
            68. 8.3.14.7.1.68 PK_MIN_AVG (EAh, Read/Write Byte)
            69. 8.3.14.7.1.69 VCMPxREF (EBh, Read/Write Byte)
            70. 8.3.14.7.1.70 PSU_VOLTAGE (ECh, Read/Write Byte)
            71. 8.3.14.7.1.71 CABLE_DROP (EDh, Read/Write Byte)
            72. 8.3.14.7.1.72 GPDAC1 (F0h, Read/Write Byte)
            73. 8.3.14.7.1.73 GPDAC2 (F1h, Read/Write Byte)
            74. 8.3.14.7.1.74 INS_DLY (F9h, Read/Write Byte)
        8. 8.3.14.8  Analog-to-digital Converter
        9. 8.3.14.9  Digital-to-analog Converters
        10. 8.3.14.10 DIRECT format Conversion
        11. 8.3.14.11 Blackbox Fault Recording
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
      3. 9.1.3 Multiple Devices, Independent Operation (Multi-zone)
    2. 9.2 Typical Application: 12-V, 4-kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Transient Protection
      2. 9.4.2 Output Short-Circuit Measurements
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) (2) TPS25990X UNIT
RQP (QFN)
26 PINS
RθJA Junction-to-ambient thermal resistance 19.9 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 4.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Based on simulations conducted with the device mounted on a JEDEC 8-layer PCB (4s4p)