SLVS227G August   1999  – June 2024

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings for TPS3123
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Dissipation Rating Table
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Manual Reset ( MR)
      2. 7.3.2 Active-High or Active-Low Output
      3. 7.3.3 Push-Pull or Open-Drain Output
      4. 7.3.4 Watchdog Timer (WDI)
    4. 7.4 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Device and Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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発注情報

8.5 Electrostatic Discharge Caution

TPS3123-xx TPS3124-xx TPS3125-xx TPS3126-xx TPS3128-xx This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.