SLVSCO3B August   2016  – October 2016 TPS54116-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Bootstrap Voltage (BOOT) and Low Dropout Operation
      3. 7.3.3  Error Amplifier
      4. 7.3.4  Voltage Reference and Adjusting the Output Voltage
      5. 7.3.5  Enable and Adjusting Undervoltage Lockout
      6. 7.3.6  Soft Start and Tracking
      7. 7.3.7  Start-up into Pre-Biased Output
      8. 7.3.8  Power Good
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/SYNC)
      11. 7.3.11 Buck Overcurrent Protection
      12. 7.3.12 Overvoltage Transient Protection
      13. 7.3.13 VTT Sink and Source Regulator
      14. 7.3.14 VTTREF
      15. 7.3.15 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Inductor Selection
        3. 8.2.2.3  Output Capacitor
        4. 8.2.2.4  Input Capacitor
        5. 8.2.2.5  Soft Start Capacitor
        6. 8.2.2.6  Undervoltage Lock Out Set Point
        7. 8.2.2.7  Bootstrap Capacitor
        8. 8.2.2.8  Power Good Pullup
        9. 8.2.2.9  ILIM Resistor
        10. 8.2.2.10 Output Voltage and Feedback Resistors Selection
        11. 8.2.2.11 Compensation
        12. 8.2.2.12 LDOIN Capacitor
        13. 8.2.2.13 VTTREF Capacitor
        14. 8.2.2.14 VTT Capacitor
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.