4 改訂履歴
Changes from B Revision (November 2014) to C Revision
- Added WEBENCH用リンクと、上端にTIリファレンス・デザイン用のナビゲーション・アイコンを Go
- Changed "Handling Ratings" to "ESD Ratings"; move Storage temperature to "Abs Max" table Go
- Changed RθJA from "47.2" to "42.8" °C/W; RθJC(top)from "64.8" to "39.4" °C/W; RθJB from "14.4" to "15.9" °C/W; ψJT from "0.5" to "0.9"°C/W ; ψJB from "14.7" to "15.9"°C/W ; RθJC(bot) from "3.2" to "3.9" °C/WGo
- Changed "Ih = 3.4 μA" to "Ih = 2.25 μA" in Equation 3Go
- Changed "OVP threshold" to "VSENSE falling (Good) threshold of 106%" in last sentence of Output Overvoltage Protection (OVP)Go
- Corrected pin name from SYNC to RT/CLK in Synchronization (CLK Mode)Go
Changes from A Revision (September 2010) to B Revision
- 「取り扱い定格」表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加Go
- Removed Bill of MaterialsGo
Changes from * Revision (August 2010) to A Revision
- Changed 「アプリケーション」の箇条書き項目Go
- Changed Figure 34 - Typical App CircuitGo
- Changed Figure 47 image with new plotGo
- Changed Figure 51 image with new plotGo
- Changed Figure 55 Thermal Signature imageGo
- Added C6 to Bill of Material and changed C8 RefDes to C9 with size 1210 to match SLVU380 User's Guide BoMGo