JAJSFL9C July 2016 – June 2018 TPS546C20A
PRODUCTION DATA.
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the reflow process can affect electrical performance. Figure 53 shows the recommended reflow-oven thermal profile. Proper post-assembly cleaning is also critical to device performance. Refer to QFN/SON PCB Attachment (SLUA271) for more information.
PARAMETER | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RAMP UP AND RAMP DOWN | |||||
rRAMP(up) | Average ramp-up rate, TS(max) to TP | 3 | °C/s | ||
rRAMP(down) | Average ramp-down rate, TP to TS(max) | 6 | °C/s | ||
PRE-HEAT | |||||
TS | Preheat temperature | 150 | 200 | °C | |
tS | Preheat time, TS(min) to TS(max) | 60 | 180 | s | |
REFLOW | |||||
TL | Liquidus temperature | 217 | °C | ||
TP | Peak temperature | 260 | °C | ||
tL | Time maintained above liquidus temperature, TL | 60 | 150 | s | |
tP | Time maintained within 5°C of peak temperature, TP | 20 | 40 | s | |
t25P | Total time from 25°C to peak temperature, TP | 480 | s |