SLVSHN0 September   2024 TPS548B23

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  D-CAP4 Control
      2. 7.3.2  Internal VCC LDO and Using External Bias On the VCC Pin
        1. 7.3.2.1 Powering the Device From a Single Bus
        2. 7.3.2.2 Powering the Device From a Split-Rail Configuration
      3. 7.3.3  Multifunction Configuration (CFG1-5) Pins
        1. 7.3.3.1 Multifunction Configuration (CFG1-2) Pins (Internal Feedback)
        2. 7.3.3.2 Multifunction Configuration (CFG1-2) Pins (External Feedback)
        3. 7.3.3.3 Multifunction Configuration (CFG3-5) Pins
      4. 7.3.4  Enable
      5. 7.3.5  Soft Start
      6. 7.3.6  Power Good
      7. 7.3.7  Overvoltage and Undervoltage Protection
      8. 7.3.8  Remote Sense
      9. 7.3.9  Low-side MOSFET Zero-Crossing
      10. 7.3.10 Current Sense and Positive Overcurrent Protection
      11. 7.3.11 Low-side MOSFET Negative Current Limit
      12. 7.3.12 Output Voltage Discharge
      13. 7.3.13 UVLO Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto-Skip (PFM) Eco-mode Light Load Operation
      2. 7.4.2 Forced Continuous-Conduction Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Setting Point
        2. 8.2.2.2 Choose the Switching Frequency
        3. 8.2.2.3 Choose the Inductor
        4. 8.2.2.4 Choose the Output Capacitor
        5. 8.2.2.5 Choose the Input Capacitors (CIN)
        6. 8.2.2.6 VCC Bypass Capacitor
        7. 8.2.2.7 BOOT Capacitor
        8. 8.2.2.8 PG Pullup Resistor
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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発注情報

D-CAP4 Control

The device uses D-CAP4 control to achieve a fast load transient response while maintaining ease-of-use. The D-CAP4 control architecture includes an internal ripple generation network enabling the use of very low-ESR output capacitors such as multi-layered ceramic capacitors (MLCC) and low ESR polymer capacitors. No external current sensing network or voltage compensators are required with D-CAP4 control architecture. The role of the internal ripple generation network is to emulate the ripple component of the inductor current information and then combine with the voltage feedback signal to regulate the loop operation.

D-CAP4 control architecture reduces loop gain variation across VOUT, enabling a fast load transient response across the entire output voltage range with one ramp setting. The R-C time-constant of the internal ramp circuit sets the zero frequency of the ramp, similar to other R-C based internal ramp generation architectures. The reduced variation in loop gain also mitigates the need for a feedforward capacitor to optimize the transient response. The ramp amplitude varies with VIN to minimize variation in loop gain across input voltage, commonly referred to as input voltage feedforward. Lastly, the device uses internal circuitry to correct for the dc offset caused by the injected ramp, and significantly reduces the dc offset caused by the output ripple voltage, especially with light load current.

For any control topologies supporting no external compensation, there is a minimum range, maximum range, or both, for the output filter it can support. The output filter used for a typical buck converter is a low-pass L-C circuit. This L-C filter has double pole that is described in Equation 1.

Equation 1. TPS548B23

At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal gain of the device. The low frequency L-C double pole has a 180-degree drop in phase. At the output filter frequency, the gain rolls off at a –40dB per decade rate and the phase drops rapidly. The internal ripple generation network introduces a high-frequency zero that reduces the gain roll off from –40dB to –20dB per decade and increases the phase by 90 degrees per decade above the zero frequency.

After identifying the application requirements, the output inductance is typically designed so the inductor peak-to-peak ripple current is approximately between 15% and 40% of the maximum output current in the application.

The inductor and capacitor selected for the output filter must be such that the double pole of Equation 1 is located no higher than 1/30th of the steady-state operating frequency. Choosing very small output capacitance leads to a high frequency L-C double pole which causes the overall loop gain to stay high until the L-C double frequency. Given the zero from the internal ripple generation network is a relatively high frequency as well, the loop with very small output capacitance can have too high of a crossover frequency which can cause instability. The internal zero is selected by the resistor at the MSEL pin, as described earlier.

In general, where reasonable (or smaller) output capacitance is desired, output ripple requirement and load transient requirement can be used to determine the necessary output capacitance for stable operation.

For the maximum output capacitance recommendation, select the inductor and capacitor values so that the L-C double pole frequency is no less than 1/100th of the operating frequency. With this starting point, verify the small signal response on the board using the following criteria: The phase margin at the loop crossover is greater than 50 degrees. The actual maximum output capacitance can go higher as long as phase margin is greater than 50 degrees. However, small signal measurement (Bode plot) must be done to confirm the design.

If MLCCs are used, consider the derating characteristics to determine the final output capacitance for the design. For example, when using an MLCC with specifications of 10µF, X5R and 6.3V, the derating by DC bias and AC bias are 80% and 50%, respectively. The effective derating is the product of these two factors, which in this case is 40% and 4µF. Consult with capacitor manufacturers for specific characteristics of the capacitors to be used in the application.

For large output filters with an L-C double pole near 1/100th of the operating frequency, additional phase boost can be required. A feedforward capacitor placed in parallel with RFB_HS can boost the phase. Refer to the Optimizing Transient Response of Internally Compensated dc-dc Converters With Feedforward Capacitor application note for details.

Besides boosting the phase, a feedforward capacitor feeds more VOUT node information into the FB node through AC coupling. This feedforward during load transient event enables faster response of the control loop to a VOUT deviation. However, this feedforward during steady state operation also feeds more VOUT ripple and noise into FB. High ripple and noise on FB usually leads to more jitter, or even double-pulse behavior. To determine the final feedforward capacitor value impacts to phase margin, load transient performance, ripple, and noise on FB must all be considered. TI recommends using frequency analysis equipment to measure the crossover frequency and the phase margin.