SLVSHN0 September   2024 TPS548B23

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  D-CAP4 Control
      2. 7.3.2  Internal VCC LDO and Using External Bias On the VCC Pin
        1. 7.3.2.1 Powering the Device From a Single Bus
        2. 7.3.2.2 Powering the Device From a Split-Rail Configuration
      3. 7.3.3  Multifunction Configuration (CFG1-5) Pins
        1. 7.3.3.1 Multifunction Configuration (CFG1-2) Pins (Internal Feedback)
        2. 7.3.3.2 Multifunction Configuration (CFG1-2) Pins (External Feedback)
        3. 7.3.3.3 Multifunction Configuration (CFG3-5) Pins
      4. 7.3.4  Enable
      5. 7.3.5  Soft Start
      6. 7.3.6  Power Good
      7. 7.3.7  Overvoltage and Undervoltage Protection
      8. 7.3.8  Remote Sense
      9. 7.3.9  Low-side MOSFET Zero-Crossing
      10. 7.3.10 Current Sense and Positive Overcurrent Protection
      11. 7.3.11 Low-side MOSFET Negative Current Limit
      12. 7.3.12 Output Voltage Discharge
      13. 7.3.13 UVLO Protection
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto-Skip (PFM) Eco-mode Light Load Operation
      2. 7.4.2 Forced Continuous-Conduction Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Voltage Setting Point
        2. 8.2.2.2 Choose the Switching Frequency
        3. 8.2.2.3 Choose the Inductor
        4. 8.2.2.4 Choose the Output Capacitor
        5. 8.2.2.5 Choose the Input Capacitors (CIN)
        6. 8.2.2.6 VCC Bypass Capacitor
        7. 8.2.2.7 BOOT Capacitor
        8. 8.2.2.8 PG Pullup Resistor
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • VAN|19
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS548B23 UNIT
VAN (QFN, JEDEC layout) VAN (QFN, application layout, 6-layer PCB)
19 PINS 19 PINS
RθJA Junction-to-ambient thermal resistance TBD 21.0(2) °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD Not applicable (3) °C/W
RθJB Junction-to-board thermal resistance TBD Not applicable (3) °C/W
ψJT Junction-to-top characterization parameter TBD °C/W
ψJB Junction-to-board characterization parameter TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Measured on 4 layer, 2oz copper, 3 inch × 3 inch layout with 1.9W dissipated in the device.
(3) The thermal test or simulation setup is not applicable to an application layout.