SLVSEQ0A May   2019  – March 2020 TPS54A24

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Efficiency (VIN = 12 V, fSW = 500 kHz)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Continuous Conduction Mode Operation (CCM)
      3. 7.3.3  VIN Pins and VIN UVLO
      4. 7.3.4  Voltage Reference and Adjusting the Output Voltage
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Enable and Adjustable UVLO
      7. 7.3.7  Soft Start and Tracking
      8. 7.3.8  Safe Start-Up Into Prebiased Outputs
      9. 7.3.9  Power Good
      10. 7.3.10 Sequencing (SS/TRK)
      11. 7.3.11 Adjustable Switching Frequency (RT Mode)
      12. 7.3.12 Synchronization (CLK Mode)
      13. 7.3.13 Bootstrap Voltage and 100% Duty Cycle Operation (BOOT)
      14. 7.3.14 Output Overvoltage Protection (OVP)
      15. 7.3.15 Overcurrent Protection
        1. 7.3.15.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.15.2 Low-Side MOSFET Overcurrent Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Switching Frequency
        3. 8.2.2.3  Output Inductor Selection
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Input Capacitor
        6. 8.2.2.6  Output Voltage Resistors Selection
        7. 8.2.2.7  Soft-Start Capacitor Selection
        8. 8.2.2.8  Undervoltage Lockout Setpoint
        9. 8.2.2.9  Bootstrap Capacitor Selection
        10. 8.2.2.10 PGOOD Pullup Resistor
        11. 8.2.2.11 Compensation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.2 Layout Example

Figure 56 through Figure 59 shows an example PCB layout and the following list provides a description of each layer.

  • The top layer has all components and the main traces for VIN, SW, VOUT and PGND. Both VIN pins are bypassed with two input capacitors placed as close as possible to the IC and are connected directly to the adjacent PGND pins. Multiple vias are placed near the input and output capacitors. The Net Tie (NT) connects AGND to PGND near CIN4.
  • Midlayer 1 has a solid PGND plane to aid with thermal performance. The other trace on this layer to connect the PGOOD pin to the pullup resistor.
  • Midlayer 2 has a wide trace connecting both VIN pins of the IC. It is also used to route the BOOT-SW capacitor (CBT) to the SW node. It also has a parallel trace for VOUT to minimize trace resistance. The rest of this layer is covered with PGND.
  • The bottom layer has the trace connecting the FB resistor divider to VOUT at the point of regulation. PGND is filled into the rest of this layer to aid with thermal performance.
Figure 56. TPS54A24 Layout Top
Figure 58. TPS54A24 Layout Midlayer 2
Figure 57. TPS54A24 Layout Midlayer 1
Figure 59. TPS54A24 Layout Bottom