JAJSQV6 February 2024 TPS54KC23
PRODUCTION DATA
THERMAL METRIC(1) | TPS54KC23 | UNIT | |||
---|---|---|---|---|---|
RZR (WQFN-FCRLF, JEDEC layout) | RZR (WQFN-FCRLF, 4-layer application layout) | RZR (WQFN-FCRLF, 6-layer EVM layout) | |||
16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 36.8 | 16.5 (2) | 13.2 (3) | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 15.3 | Not applicable (4) | Not applicable (4) | °C/W |
RθJB | Junction-to-board thermal resistance | 7.6 | Not applicable (4) | Not applicable (4) | °C/W |
ψJT | Junction-to-top characterization parameter | 0.3 | Not applicable (4) | Not applicable (4) | °C/W |
ψJB | Junction-to-board characterization parameter | 7.5 | Not applicable (4) | Not applicable (4) | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 5.1 | Not applicable (4) | Not applicable (4) | °C/W |