JAJSN94A december   2022  – may 2023 TPS562242

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3™ Control Mode
      2. 7.3.2 Eco-mode Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Large Duty Operation
      6. 7.3.6 Current Protection and Undervoltage Protection
      7. 7.3.7 Undervoltage Lockout (UVLO) Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Bootstrap Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Custom Design with WEBENCH® Tools
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) DRL (SOT-563) UNIT
6 PINS
RθJA(2) Junction-to-ambient thermal resistance 137.4 °C/W
RθJA_effective(3) Junction-to-ambient thermal resistance on EVM board 74 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.8 °C/W
RθJB Junction-to-board thermal resistance 29.8 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 29.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The value of RθJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were simulated on a standard JEDEC board. These values do not represent the performance obtained in an actual application.
(3) This RθJA_effective is tested on TPS562242EVM board (2 layer, copper thickness is 2-oz) at VIN = 12 V, VOUT =5 V, IOUT = 2A, TA = 25°C.