JAJSTY5B December   2015  – September 2024 TPS563201 , TPS563208

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adaptive On-Time Control and PWM Operation
      2. 6.3.2 Pulse Skip Control (TPS563201)
      3. 6.3.3 Soft Start and Pre-Biased Soft Start
      4. 6.3.4 Current Protection
      5. 6.3.5 Undervoltage Lockout (UVLO) Protection
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Eco-mode Operation
      3. 6.4.3 Standby Operation
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design with WEBENCH® Tools
        2. 7.2.2.2 Output Voltage Resistors Selection
        3. 7.2.2.3 Output Filter Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Bootstrap Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

  1. VIN and GND traces must be as wide as possible to reduce trace impedance. The wide areas are also of advantage from the view point of heat dissipation.
  2. The input capacitor and output capacitor must be placed as close to the device as possible to minimize trace impedance.
  3. Provide sufficient vias for the input capacitor and output capacitor.
  4. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
  5. Do not allow switching current to flow under the device.
  6. A separate VOUT path must be connected to the upper feedback resistor.
  7. Make a Kelvin connection to the GND pin for the feedback path.
  8. Voltage feedback loop must be placed away from the high-voltage switching trace, and preferably has ground shield.
  9. The trace of the VFB node must be as small as possible to avoid noise coupling.
  10. The GND trace between the output capacitor and the GND pin must be as wide as possible to minimize its trace impedance.