JAJSEX9A July   2011  – March 2018 TPS61256A

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      最小のソリューション・サイズのアプリケーション
      2.      効率と負荷電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Softstart
    3. 8.3 Undervoltage Lockout
    4. 8.4 Thermal Regulation
    5. 8.5 Thermal Shutdown
    6. 8.6 Functional Block Diagram
    7. 8.7 Feature Description
      1. 8.7.1 Power-Save Mode
      2. 8.7.2 Current Limit Operation
      3. 8.7.3 Enable
      4. 8.7.4 Load Disconnect And Reverse Current Protection
    8. 8.8 Device Functional Modes
      1. 8.8.1 Load Disconnect And Reverse Current Protection
      2. 8.8.2 Softstart
      3. 8.8.3 Undervoltage Lockout
      4. 8.8.4 Thermal Regulation
      5. 8.8.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
          1. 9.2.2.1.1 High-frequency Converter Applications
        2. 9.2.2.2 Output Capacitor
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Checking Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Package Summary
    1. 12.1 Package Dimensions
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • YFF|9
サーマルパッド・メカニカル・データ
発注情報

11.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The maximum junction temperature (TJ) of the TPS61256A is 125°C.