JAJSEX9A July   2011  – March 2018 TPS61256A

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      最小のソリューション・サイズのアプリケーション
      2.      効率と負荷電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Softstart
    3. 8.3 Undervoltage Lockout
    4. 8.4 Thermal Regulation
    5. 8.5 Thermal Shutdown
    6. 8.6 Functional Block Diagram
    7. 8.7 Feature Description
      1. 8.7.1 Power-Save Mode
      2. 8.7.2 Current Limit Operation
      3. 8.7.3 Enable
      4. 8.7.4 Load Disconnect And Reverse Current Protection
    8. 8.8 Device Functional Modes
      1. 8.8.1 Load Disconnect And Reverse Current Protection
      2. 8.8.2 Softstart
      3. 8.8.3 Undervoltage Lockout
      4. 8.8.4 Thermal Regulation
      5. 8.8.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
          1. 9.2.2.1.1 High-frequency Converter Applications
        2. 9.2.2.2 Output Capacitor
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Checking Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Package Summary
    1. 12.1 Package Dimensions
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • YFF|9
サーマルパッド・メカニカル・データ
発注情報

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
UNIT
Input voltage Voltage at VIN(2), VOUT(2), SW(2), EN(2) –0.3 to 7 V
Input current Steady state DC current into SW 2.3 A
Power dissipation Internally limited
Temperature range Operationg temperature range, TA(3) –40 to 85 °C
Operating virtual junction, TJ –40 to 150 °C
Storage temperature range, Tstg –65 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 105°C.