JAJSPC6 November   2023 TPS61377

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCC Power Supply
      2. 7.3.2 Enable and Programmable UVLO
      3. 7.3.3 Soft Start
      4. 7.3.4 Switching Frequency
      5. 7.3.5 Programmable Inductor Peak Current Limit
      6. 7.3.6 Shut Down
      7. 7.3.7 Overvoltage Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation
      2. 7.4.2 Forced PWM Mode
      3. 7.4.3 Auto PFM Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Bootstrap Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Loop Stability
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS61377 UNIT
VQFN
13 PINS
RθJA Junction-to-ambient thermal resistance 64.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.4 °C/W
RθJB Junction-to-board thermal resistance 15.4 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 15.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.