JAJSJ29E May   2020  – October 2024 TPS61378-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VCC Power Supply
      2. 7.3.2  Input Undervoltage Lockout (UVLO)
      3. 7.3.3  Enable and Soft Start
      4. 7.3.4  Shut Down
      5. 7.3.5  Switching Frequency Setting
      6. 7.3.6  Spread Spectrum Frequency Modulation
      7. 7.3.7  Adjustable Peak Current Limit
      8. 7.3.8  Bootstrap
      9. 7.3.9  Load Disconnect
      10. 7.3.10 MODE/SYNC Configuration
      11. 7.3.11 Overvoltage Protection (OVP)
      12. 7.3.12 Output Short Protection/Hiccup
      13. 7.3.13 Power-Good Indicator
      14. 7.3.14 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forced PWM Mode
      2. 7.4.2 Auto PFM Mode
      3. 7.4.3 External Clock Synchronization
      4. 7.4.4 Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
        2. 8.2.2.2 Setting the Switching Frequency
        3. 8.2.2.3 Setting the Current Limit
        4. 8.2.2.4 Selecting the Inductor
        5. 8.2.2.5 Selecting the Output Capacitors
        6. 8.2.2.6 Selecting the Input Capacitors
        7. 8.2.2.7 Loop Stability and Compensation
          1. 8.2.2.7.1 Small Signal Model
          2. 8.2.2.7.2 Loop Compensation Design Steps
          3. 8.2.2.7.3 Selecting the Bootstrap Capacitor
          4. 8.2.2.7.4 VCC Capacitor
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 サード・パーティ製品に関する免責事項
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 用語集
    6. 11.6 静電気放電に関する注意事項
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.14 Thermal Shutdown

A thermal shutdown is implemented to prevent damage due to excessive heat and power dissipation. Typically, the thermal shutdown occurs at junction temperatures exceeding 165°C. When the thermal shutdown is triggered, the device stops switching and recovers when the junction temperature falls below 145°C (typical).