1 |
VOS |
I |
Output voltage sense pin and connection for the control loop circuitry. The VOS pin must be connected directly at the output capacitor. |
2 |
SW |
PWR |
This pin is a switch node and is connected to the internal MOSFET switches. Connect an inductor between the SW pin and output capacitor. |
3 |
4 |
PG |
O |
Output power-good pin. The PG pin is an open drain and requires a pullup resistor. If this pin is not in use, leave it floating. |
5 |
FBS |
I |
Output-voltage feedback pin. This pin is used for a positive remote sense of the load voltage. The FBS pin must be connected close to the load-supply node on the output bus. |
6 |
AGND |
— |
Analog ground pin. The AGND pin must be connected directly to the exposed thermal pad and common ground plane. |
7 |
SS |
O |
Soft-start pin. An external capacitor connected to this pin sets the soft-start time. |
8 |
VID1 |
I |
Output-voltage selection pins (VIDx). |
9 |
VID0 |
10 |
AVIN |
I |
Supply-voltage pin for the internal control circuitry. Connect the AVIN pin to the same source as the PVIN pin. |
11 |
PVIN |
PWR |
Supply-voltage pins for the internal power stage. |
12 |
13 |
EN |
I |
Enable and disable input pin. An internal pulldown resistor maintains logic-level low if the pin is floating. |
14 |
LPM |
I |
Low-power-mode input pin. |
15 |
PGND |
— |
Power ground. The PGND pin must be connected directly to the exposed thermal pad and common ground plane. |
16 |
— |
Exposed Thermal Pad |
— |
The exposed thermal pad must be connected to the AGND (6) pin, PGND (15 and 16) pins, and common ground plane. The thermal pad must be soldered to achieve appropriate power dissipation and mechanical reliability. |