JAJSHS1D July   2013  – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図(WCSP)
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Power Good
      2. 9.3.2 Overvoltage Protection
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Thermal Shutdown
      5. 9.3.5 Soft Start
      6. 9.3.6 Short Circuit Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Control Loop Description
      2. 9.4.2 Power Save Mode Operation
      3. 9.4.3 Adjustable Current Limit
      4. 9.4.4 Device Enable
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Output Filter Design
        3. 10.2.2.3 Inductor Selection
        4. 10.2.2.4 Capacitor selection
          1. 10.2.2.4.1 Input Capacitor
          2. 10.2.2.4.2 Output Capacitor
        5. 10.2.2.5 Setting the Output Voltage
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example (WCSP)
    3. 12.3 Layout Example (HotRod)
    4. 12.4 Thermal Considerations
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 WEBENCH®ツールによるカスタム設計
    2. 13.2 デバイス・サポート
      1. 13.2.1 デベロッパー・ネットワークの製品に関する免責事項
    3. 13.3 関連リンク
    4. 13.4 ドキュメントの更新通知を受け取る方法
    5. 13.5 コミュニティ・リソース
    6. 13.6 商標
    7. 13.7 静電気放電に関する注意事項
    8. 13.8 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1 Layout Guidelines

The PCB layout is an important step to maintain the high performance of the TPS6305x devices.

  • Place input and output capacitors as close as possible to the IC. Traces need to be kept short. Routing wide and direct traces to the input and output capacitor results in low-trace resistance and low parasitic inductance.
  • Use a common-power GND.
  • The sense trace connected to FB is signal trace. Keep these traces away from L1 and L2 nodes.
  • For the HotRod package option it is important to add a capacitor between FB node and ground to filter ground noise and to match efficiency results documented in these datasheet.