JAJSHS1D July   2013  – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図(WCSP)
      2.      効率と出力電流との関係
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Power Good
      2. 9.3.2 Overvoltage Protection
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Thermal Shutdown
      5. 9.3.5 Soft Start
      6. 9.3.6 Short Circuit Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Control Loop Description
      2. 9.4.2 Power Save Mode Operation
      3. 9.4.3 Adjustable Current Limit
      4. 9.4.4 Device Enable
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Output Filter Design
        3. 10.2.2.3 Inductor Selection
        4. 10.2.2.4 Capacitor selection
          1. 10.2.2.4.1 Input Capacitor
          2. 10.2.2.4.2 Output Capacitor
        5. 10.2.2.5 Setting the Output Voltage
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example (WCSP)
    3. 12.3 Layout Example (HotRod)
    4. 12.4 Thermal Considerations
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 WEBENCH®ツールによるカスタム設計
    2. 13.2 デバイス・サポート
      1. 13.2.1 デベロッパー・ネットワークの製品に関する免責事項
    3. 13.3 関連リンク
    4. 13.4 ドキュメントの更新通知を受け取る方法
    5. 13.5 コミュニティ・リソース
    6. 13.6 商標
    7. 13.7 静電気放電に関する注意事項
    8. 13.8 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.4 Thermal Considerations

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.

Two basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Introducing airflow in the system

For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics (SZZA017), and Semiconductor and IC Package Thermal Metrics (SPRA953)