SLVS501B February   2004  – September 2015 TPS65011

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Battery Charger Electrical Characteristics
    7. 6.7 Serial Interface Timing Requirements
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Battery Charger
        1. 7.3.1.1 Autonomous Power Source Selection
        2. 7.3.1.2 Temperature Qualification
        3. 7.3.1.3 Battery Preconditioning
        4. 7.3.1.4 Battery Charge Current
        5. 7.3.1.5 Battery Voltage Regulation
        6. 7.3.1.6 Charge Termination and Recharge
        7. 7.3.1.7 Sleep Mode
        8. 7.3.1.8 PG Output
        9. 7.3.1.9 Thermal Considerations for Setting Charge Current
      2. 7.3.2 Step-Down Converters, VMAIN and VCORE
        1. 7.3.2.1 Power Save Mode Operation
        2. 7.3.2.2 Forced PWM
        3. 7.3.2.3 Dynamic Voltage Positioning
        4. 7.3.2.4 Soft Start
        5. 7.3.2.5 100% Duty Cycle Low Dropout Operation
        6. 7.3.2.6 Active Discharge When Disabled
        7. 7.3.2.7 Power-Good Monitoring
        8. 7.3.2.8 Overtemperature Shutdown
      3. 7.3.3 Low-Dropout Voltage Regulators
        1. 7.3.3.1 Power-Good Monitoring
        2. 7.3.3.2 Enable and Sequencing
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Power-Up Sequencing
      6. 7.3.6 System Reset and Control Signals
      7. 7.3.7 Vibrator Driver
    4. 7.4 Device Functional Modes
      1. 7.4.1 TPS65011 Power States Description
        1. 7.4.1.1 State 1: No Power
        2. 7.4.1.2 State 2: ON
        3. 7.4.1.3 State 3: Low-Power Mode
        4. 7.4.1.4 State 4: Shutdown
    5. 7.5 Programming
      1. 7.5.1 LED2 Output
      2. 7.5.2 Interrupt Management
      3. 7.5.3 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1  CHGSTATUS Register (Address: 01h—Reset: 00h)
      2. 7.6.2  REGSTATUS Register (Address: 02h—Reset: 00h)
      3. 7.6.3  MASK1 Register (Address: 03h—Reset: FFh)
      4. 7.6.4  MASK2 Register (Address: 04h—Reset: FFh)
      5. 7.6.5  ACKINT1 Register (Address: 05h—Reset: 00h)
      6. 7.6.6  ACKINT2 Register (Address: 06h—Reset: 00h)
      7. 7.6.7  CHGCONFIG Register Address: 07h—Reset: 1Bh
      8. 7.6.8  LED1_ON Register (Address: 08h—Reset: 00h)
      9. 7.6.9  LED1_PER Register (Address: 09h—Reset: 00h)
      10. 7.6.10 LED2_ON Register (Address: 0Ah—Reset: 00h)
      11. 7.6.11 LED2_PER (Register Address: 0Bh—Reset: 00h)
      12. 7.6.12 VDCDC1 Register (Address: 0Ch—Reset: 32h/33h)
      13. 7.6.13 VDCDC2 Register (Address: 0Dh—Reset: 60h/70h)
      14. 7.6.14 VREGS1 Register (Address: 0Eh—Reset: 88h)
      15. 7.6.15 MASK3 Register (Address: 0Fh—Reset: 00h)
      16. 7.6.16 DEFGPIO Register Address: (10h—Reset: 00h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the Main and the Core Converter
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 LDO1 Output Voltage Adjustment
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The VCORE and VMAIN converter are always enabled in a typical application. The VCORE output voltage can be disabled or reduced from 1.5 V to a lower, preset voltage under processor control. When the processor enters the sleep mode, a high signal on the LOW_PWR pin initiates the change.

VCORE typically supplies the digital part of the audio codec. When the processor is in sleep or low-power mode, the audio codec is powered off, so the VCORE voltage can be programmed to lower voltages without a problem. A typical audio codec (e.g., TI AIC23) consumes about 20-mA to 30-mA current from the VCORE power supply.

Supply LDO1 from VMAIN as shown in Figure 43. If this is not done, then subsequent to a UVLO, OVERTEMP, or BATT_COVER = 0 condition, the RESPWRON signal goes high before the VCORE rail has ramped and stabilized. Therefore, the processor core does not receive a power-on-reset signal.

8.2 Typical Applications

TPS65011 ai_typ_cir_lvs501.gif Figure 43. Typical Application Circuit

8.2.1 Design Requirements

Each DC-DC converter requires an external inductor and filter capacitor, capable of sustain the intended current with an acceptable voltage ripple. LDOs must have external filter capacitors, and LDO1 requires an external feedback network for regulation. Every input supply rail requires a decoupling capacitor close to the pin, and to avoid unintended states, logic inputs without internal resistors must not be left floating.

8.2.2 Detailed Design Procedure

8.2.2.1 Inductor Selection for the Main and the Core Converter

The main and the core converters in the TPS65011 typically use a 6.2-µH and a 10-µH output inductor, respectively. Larger or smaller inductor values can be used to optimize the performance of the device for specific operation conditions. The selected inductor has to be rated for its dc resistance and saturation current. The dc resistance of the inductance influences directly the efficiency of the converter. Therefore, an inductor with lowest dc resistance is selected for highest efficiency.

Equation 3 calculates the maximum inductor current under static load conditions. The saturation current of the inductor must be rated higher than the maximum inductor current as calculated with Equation 3. This is needed because during heavy load transient, the inductor current rises above the value calculated under Equation 3.

Equation 3. TPS65011 Q_delta_IL_lvs149.gif
Equation 4. TPS65011 Q_IL_max_lvs149.gif

where

  • f = Switching frequency (1.25 MHz typical)
  • L = Inductor value
  • ΔIL= Peak-to-peak inductor ripple current
  • ILmax = Maximum inductor current

The highest inductor current occurs at maximum VI.

Open core inductors have a soft saturation characteristic, and they can usually handle higher inductor currents versus a comparable shielded inductor.

A more conservative approach is to select the inductor current rating just for the maximum switch current of the TPS65011 (2 A for the main converter and 0.8 A for the core converter). Keep in mind that the core material from inductor to inductor differs and has an impact on the efficiency especially at high switching frequencies.

Refer to Table 5 and the typical applications for possible inductors

Table 5. Tested Inductors

DEVICE INDUCTOR VALUE DIMENSIONS COMPONENT SUPPLIER
Core converter 10 µH 6,0 mm × 6,0 mm × 2,0 mm Sumida CDRH5D18-100
10 µH 5,0 mm × 5,0 mm × 3,0 mm Sumida CDRH4D28-100
Main converter 4.7 µH 5,5 mm × 6,6 mm x 1,0 mm Coilcraft LPO1704-472M
4.7 µH 5,0 mm × 5,0 mm × 3,0 mm Sumida CDRH4D28C-4.7
4.7 µH 5,2 mm × 5,2 mm × 2,5 mm Coiltronics SD25-4R7
5.3 µH 5,7 mm × 5,7 mm × 3,0 mm Sumida CDRH5D28-5R3
6.2 µH 5,7 mm × 5,7 mm × 3,0 mm Sumida CDRH5D28-6R2
6.0 µH 7,0 mm × 7,0 mm × 3,0 mm Sumida CDRH6D28-6R0

8.2.2.2 Output Capacitor Selection

The advanced fast response voltage mode control scheme of the inductive converters implemented in the TPS65011 allow the use of small ceramic capacitors with a typical value of 22 µF for the main converter and 10 µF for the core converter without having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low ESR values have the lowest output voltage ripple and are recommended. If required tantalum capacitors with an ESR < 100 ΩR may be used as well.

Refer to Table 6 for recommended components.

If ceramic output capacitors are used, the capacitor RMS ripple current rating always meet the application requirements. Just for completeness the RMS ripple current is calculated as:

Equation 5. TPS65011 Q_Irms_lvs149.gif

At nominal load current, the inductive converters operate in PWM mode and the overall output voltage ripple is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the output capacitor:

Equation 6. TPS65011 Q_delta_VO_lvs149.gif

Where the highest output voltage ripple occurs at the highest input voltage VI.

At light load currents, the converters operate in power save mode and the output voltage ripple is independent of the output capacitor value. The output voltage ripple is set by the internal comparator thresholds. The typical output voltage ripple is 1% of the nominal output voltage. If the output voltage for the core converter is programmed to its lowest voltage of 0.85 V, the output capacitor must be increased to 22 µF for low output voltage ripple. This is because the current in the inductor decreases slowly during the off-time and further increases the output voltage even when the PMOS is off. This effect increases with low output voltages.

8.2.2.3 Input Capacitor Selection

A pulsating input current is the nature of the buck converter. Therefore, a low ESR input capacitor is required for best input voltage filtering. It also minimizes the interference with other circuits caused by high input voltage spikes. The main converter needs a 22-µF ceramic input capacitor and the core converter a 10-µF ceramic capacitor. The input capacitor for the main and the core converter can be combined and one 22-µF capacitor can be used instead, because the two converters operate with a phase shift of 270 degrees. The input capacitor can be increased without any limit for better input voltage filtering. The VCC pin must be separated from the input for the main and the core converter. A filter resistor of up to 100 Ω and a 1-µF capacitor is used for decoupling the VCC pin from switching noise.

Table 6. Possible Capacitors

CAPACITOR VALUE CASE SIZE COMPONENT SUPPLIER COMMENTS
22 µF 1206 TDK C3216X5R0J226M Ceramic
22 µF 1206 Taiyo Yuden JMK316BJ226ML Ceramic
22 µF 1210 Taiyo Yuden JMK325BJ226MM Ceramic

Application Curves

TPS65011 eff0_core_lvs149.gif Figure 44. Efficiency vs Output Current
TPS65011 eff0_main_lvs149.gif Figure 45. Efficiency vs Output Current

8.3 System Examples

TPS65011 ai_lp_typcir_lvs501.gif Figure 46. Typical Application Circuit in Low-Power Mode