SLVSC01A June   2013  – April 2015 TPS65133

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Typical Application
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Boost Converter (VPOS)
        1. 8.3.1.1 Switching Frequency (VPOS)
        2. 8.3.1.2 Output Voltage (VPOS)
        3. 8.3.1.3 Startup (VPOS)
        4. 8.3.1.4 Shutdown (VPOS)
        5. 8.3.1.5 Active Discharge (VPOS)
        6. 8.3.1.6 Short-Circuit Protection (VPOS)
      2. 8.3.2 Inverting Buck-Boost Converter (VNEG)
        1. 8.3.2.1 Switching Frequency (VNEG)
        2. 8.3.2.2 Output Voltage (VNEG)
        3. 8.3.2.3 Startup (VNEG)
        4. 8.3.2.4 Shutdown
        5. 8.3.2.5 Active Discharge (VNEG)
        6. 8.3.2.6 Short-Circuit Protection (VNEG)
      3. 8.3.3 Startup and Shutdown Sequencing
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VI < 2.9 V
      2. 8.4.2 Operation with VI ≈ VPOS (Diode Mode)
      3. 8.4.3 Operation with EN
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Capacitor Selection
      3. 9.2.3 Application Performance Graphs
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Input voltage(2) PVIN, AVIN, EN, SWP, VPOS –0.3 6 V
VNEG –6.5 0.3 V
SWN –6.5 5.5 V
Junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) With respect to GND pin.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions(1)

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VI Input voltage 2.9 3.7 5 V
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C
(1) Refer to the Application Information section for additional information.

7.4 Thermal Information

THERMAL METRIC(1) TPS65133 UNIT
DPD (WSON)
12 PINS
RθJA Junction-to-ambient thermal resistance 51.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.7
RθJB Junction-to-board thermal resistance 25
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 25.2
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VI = 3.7 V, EN = VI, VPOS = 5.0 V, VNEG = –5.0 V, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT AND THERMAL PROTECTION
VI Input voltage 2.9 5 V
Shut down supply current EN = GND
I(IN) = I(AVIN) + I(PVIN) + I(SWP)
0.1 15 μA
Undervoltage lockout threshold VI falling 2.1 V
Undervoltage lockout threshold VI rising 2.5 V
Thermal shutdown temperature 135 °C
LOGIC SIGNALS (EN)
High-level input voltage 1.2 V
Low-level input voltage 0.4 V
BOOST CONVERTER (VPOS)
VPOS Output voltage 4.95 5 5.05 V
Low-side MOSFET on-state resistance I(SWP) = 200 mA 250
High-side MOSFET on-state resistance I(SWP) = –200 mA 350
High-side MOSFET current limit Inductor valley current 0.8 1.1 A
V(SCP)(P) Short-circuit threshold in operation VPOS falling 4.1 V
Active discharge resistance EN = GND; I(VPOS) = 1 mA 15 30 60 Ω
Line regulation IPOS = 100 mA 0.02 %/V
Load regulation 0.24 %/A
BUCK-BOOST CONVERTER (VNEG)
VNEG Negative output voltage default –5.05 –5 –4.95 V
High-side MOSFET on-state resistance I(SWN) = –200 mA 250
Low-side MOSFET on-state resistance I(SWN) = 200 mA 350
Low-side MOSFET current limit Inductor valley current 1.5 2.2 A
V(SCP)(N) Short-circuit threshold in operation –4.5 V
Active discharge resistance EN = GND; I(VNEG) = –1 mA 100 150 200 Ω
Line regulation INEG = –100 mA 0.01 %/V
Load regulation 0.16 %/A

7.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
BOOST CONVERTER (VPOS)
Switching frequency IPOS = 200 mA 1.2 1.7 2.2 MHz
Short-circuit detection time The delay from when VPOS < V(SCP)(P) to when the boost converter turns off 1 3 5 ms
BUCK-BOOST CONVERTER (VNEG)
Switching frequency INEG = –200 mA 1 1.7 2.4 MHz
Short-circuit detection time The delay from when VNEG > V(SCP)(N) to when the inverting buck-boost converter turns off 1 3 5 ms
Start-up delay The delay from when VPOS has reached its target value to when VNEG starts ramping 2 ms

7.7 Typical Characteristics

TPS65133 SLVSC01_TYP_CHAR_01.png
Figure 1. Shutdown Current into AVIN and PVIN
TPS65133 SLVSC01_TYP_CHAR_03.png
Figure 3. Boost Converter Rectifier rDS(on)
TPS65133 SLVSC01_TYP_CHAR_05.png
Figure 5. Inverting Buck-Boost Converter Rectifier rDS(on)
TPS65133 SLVSC01_TYP_CHAR_02.png
Figure 2. Boost Converter Switch rDS(on)
TPS65133 SLVSC01_TYP_CHAR_04.png
Figure 4. Inverting Buck-Boost Converter Switch rDS(on)