SLVSA76G March   2010  – January 2016 TPS65180B , TPS65181 , TPS65181B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Data Transmission Timing
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Modes of Operation
      2. 9.3.2 Mode Transisitons
      3. 9.3.3 Wake-Up and Power Up Sequencing
      4. 9.3.4 GPIO Control
      5. 9.3.5 I2C Control
    4. 9.4 Device Functional Modes
      1. 9.4.1 The FIX_RD_PTR Bit
    5. 9.5 Register Maps
      1. 9.5.1  Thermistor Readout (TMST_VALUE) Register (Offset = 0x00h)
      2. 9.5.2  Enable (ENABLE) Register (Offset = 0x01h)
      3. 9.5.3  Positive Voltage Rail Adjustment (VP_ADJUST) Register (Offset = 0x02h)
      4. 9.5.4  Negative Voltage Rail Adjustment (VN_ADJUST) Register (Offset = 0x03h)
      5. 9.5.5  VCOM Adjustment (VCOM_ADJUST) Register (Offset = 0x04h)
      6. 9.5.6  Interrupt Enable 1 (INT_ENABLE1) Register (Offset = 0x05h)
      7. 9.5.7  Interrupt Enable 2 (INT_ENABLE2) Register (Offset = 0x06h)
      8. 9.5.8  Interrupt INT_STATUS1 (INT_STATUS1) Register (Offset = 0x07h)
      9. 9.5.9  Interrupt Status 2 (INT_STATUS2) Register (Offset = 0x08h)
      10. 9.5.10 Power Sequence Register 0 (PWR_SEQ0) Register (Offset = 0x09h)
      11. 9.5.11 Power Sequence Register 1 (PWR_SEQ1) Register (Offset = 0x0Ah)
      12. 9.5.12 Power Sequence Register 2 (PWR_SEQ2) Register (Offset = 0x0Bh)
      13. 9.5.13 Thermistor Configuration Register (TMST_CONFIG) (Offset = 0x0Ch)
      14. 9.5.14 Thermistor Hot Threshold (TMST_OS) Register (Offset = 0x0Dh)
      15. 9.5.15 Thermistor Cool Threshold (TMST_HYST) Register (Offset = 0x0Eh)
      16. 9.5.16 Power-Good Status (PG_STATUS) Register (Offset = 0x0Fh)
      17. 9.5.17 Revision and Version Control (REVID) Register (Offset = 0x10h)
      18. 9.5.18 I2C Read Pointer Control (FIX_READ_POINTER) Register (Offset = 0x11h) (TPS65181 and TPS65181B ONLY)
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1  Dependencies Between Rails
      2. 10.1.2  Soft-Start
      3. 10.1.3  VCOM Adjustment
      4. 10.1.4  VCOM Adjustment Through Register Control
      5. 10.1.5  VCOM Adjustment Through External Potentiometer
      6. 10.1.6  VPOS and VNEG Supply Tracking
      7. 10.1.7  Fault Handling and Recovery
      8. 10.1.8  TPS65180 and TPS65180B Fault Handling
      9. 10.1.9  TPS65181 and TPS65181B Fault Handling
      10. 10.1.10 Power-Good Pin
      11. 10.1.11 Interrupt Pin
      12. 10.1.12 Panel Temperature Monitoring
      13. 10.1.13 NTC Bias Circuit
      14. 10.1.14 TPS65180 and TPS65180B Temperature Acquisition
      15. 10.1.15 TPS65181 and TPS65181B Temperature Acquisition
      16. 10.1.16 Overtemperature Reporting
      17. 10.1.17 Overtemperature Fault Queuing
      18. 10.1.18 TPS65181 and TPS65181B Temperature Sensor
      19. 10.1.19 I2C Bus Operation
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Layout

12.1 Layout Guidelines

The layout guidelines are listed as follows.

  • PBKG die substrate must connect to VN (–16 V) with short, wide trace. Wide copper trace improves heat dissipation.
  • The PowerPAD is internally connected to PBKG and must be connected to ground, but connected to VN with a short, wide copper trace.
  • Inductor traces must be kept on the PCB top layer free of any vias.
  • Feedback traces must be routed away from any potential noise source to avoid coupling.
  • Output caps must be placed immediately at output pin.
  • VIN pins must be bypassed to ground with low-ESR ceramic bypass capacitors.

12.2 Layout Example

TPS65180 TPS65181 TPS65180B TPS65181B Layout_ex_SLVSA76_2.gif Figure 17. Layout Top Layer
TPS65180 TPS65181 TPS65180B TPS65181B Layout_ex_SLVSA76.gif Figure 18. Layout Bottom Layer