SLVSAI6A June   2011  – January 2016 TPS65735

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Power-On Hours (POH)
    4. 4.4 Recommended Operating Conditions
    5. 4.5 Thermal Information
    6. 4.6 Electrical Characteristics
    7. 4.7 Quiescent Current
    8. 4.8 Typical Characteristics
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 System Operation
        1. 5.3.1.1 System Power Up
        2. 5.3.1.2 System Operation Using Push Button Switch
        3. 5.3.1.3 System Operation Using Slider Switch
      2. 5.3.2 Linear Charger Operation
        1. 5.3.2.1 Battery and TS Detection
        2. 5.3.2.2 Battery Charging
          1. 5.3.2.2.1 Pre-charge
          2. 5.3.2.2.2 Charge Termination
          3. 5.3.2.2.3 Recharge
          4. 5.3.2.2.4 Charge Timers
        3. 5.3.2.3 Charger Status (nCHG_STAT Pin)
      3. 5.3.3 LDO Operation
        1. 5.3.3.1 LDO Internal Current Limit
      4. 5.3.4 Boost Converter Operation
        1. 5.3.4.1 Boost Thermal Shutdown
        2. 5.3.4.2 Boost Load Disconnect
      5. 5.3.5 Full H-Bridge Analog Switches
        1. 5.3.5.1 H-Bridge Switch Control
      6. 5.3.6 Power Management Core Control
        1. 5.3.6.1 SLEEP / Power Control Pin Function
        2. 5.3.6.2 COMP Pin Functionality
        3. 5.3.6.3 SW_SEL Pin Functionality
        4. 5.3.6.4 SWITCH Pin
        5. 5.3.6.5 Slider Switch Behavior
        6. 5.3.6.6 Push-Button Switch Behavior
    4. 5.4 Device Functional Modes
      1. 5.4.1 SLEEP State
      2. 5.4.2 NORMAL Operating Mode
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Active Shutter 3D Glasses
        1. 6.2.1.1 Design Requirements
        2. 6.2.1.2 Detailed Design Procedure
          1. 6.2.1.2.1 Reducing System Quiescent Current (IQ)
          2. 6.2.1.2.2 Boost Converter Application Information
            1. 6.2.1.2.2.1 Setting Boost Output Voltage
            2. 6.2.1.2.2.2 Boost Inductor Selection
            3. 6.2.1.2.2.3 Boost Capacitor Selection
          3. 6.2.1.2.3 Bypassing Default Push-Button SWITCH Functionality
        3. 6.2.1.3 Application Curves
  7. 7  Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Community Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Device and Documentation Support

9.1 Device Support

9.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

9.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

9.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

9.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

9.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.