SWCS037I May   2008  – January 2015 TPS65920 , TPS65930

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Attributes
    3. 3.3 Signal Descriptions
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Characteristics for ZCH Package
    5. 4.5 Minimum Voltages and Associated Currents
    6. 4.6 Digital I/O Electrical Characteristics
    7. 4.7 Timing Requirements and Switching Characteristics
      1. 4.7.1 Timing Parameters
      2. 4.7.2 Target Frequencies
      3. 4.7.3 I2C Timing
      4. 4.7.4 Audio Interface: TDM/I2S Protocol
        1. 4.7.4.1 I2S Right- and Left-Justified Data Format
        2. 4.7.4.2 TDM Data Format
      5. 4.7.5 JTAG Interfaces
  5. 5Detailed Description
    1. 5.1 Power Module
      1. 5.1.1 Power Providers
        1. 5.1.1.1  VDD1 DC-DC Regulator
          1. 5.1.1.1.1 VDD1 DC-DC Regulator Characteristics
          2. 5.1.1.1.2 External Components and Application Schematics
        2. 5.1.1.2  VDD2 DC-DC Regulator
          1. 5.1.1.2.1 VDD2 DC-DC Regulator Characteristics
          2. 5.1.1.2.2 External Components and Application Schematics
        3. 5.1.1.3  VIO DC-DC Regulator
          1. 5.1.1.3.1 VIO DC-DC Regulator Characteristics
          2. 5.1.1.3.2 External Components and Application Schematics
        4. 5.1.1.4  VDAC LDO Regulator
        5. 5.1.1.5  VPLL1 LDO Regulator
        6. 5.1.1.6  VMMC1 LDO Regulator
        7. 5.1.1.7  VAUX2 LDO Regulator
        8. 5.1.1.8  Output Load Conditions
        9. 5.1.1.9  Charge Pump
        10. 5.1.1.10 USB LDO Short-Circuit Protection Scheme
      2. 5.1.2 Power References
      3. 5.1.3 Power Control
        1. 5.1.3.1 Backup Battery Charger
        2. 5.1.3.2 Battery Monitoring and Threshold Detection
          1. 5.1.3.2.1 Power On/Power Off and Backup Conditions
        3. 5.1.3.3 VRRTC LDO Regulator
      4. 5.1.4 Power Consumption
      5. 5.1.5 Power Management
        1. 5.1.5.1 Boot Modes
        2. 5.1.5.2 Process Modes
          1. 5.1.5.2.1 MC021 Mode
        3. 5.1.5.3 Power-On Sequence
          1. 5.1.5.3.1 Timing Before Sequence_Start
          2. 5.1.5.3.2 Power-On Sequence
          3. 5.1.5.3.3 Power On in Slave_C021 Mode
        4. 5.1.5.4 Power-Off Sequence
          1. 5.1.5.4.1 Power-Off Sequence
    2. 5.2 Real-Time Clock and Embedded Power Controller
      1. 5.2.1 RTC
        1. 5.2.1.1 Backup Battery
      2. 5.2.2 EPC
    3. 5.3 USB Transceiver
      1. 5.3.1 Features
      2. 5.3.2 HS USB Port Timing
      3. 5.3.3 USB-CEA Carkit Port Timing
      4. 5.3.4 PHY Electrical Characteristics
        1. 5.3.4.1 HS Differential Receiver
        2. 5.3.4.2 HS Differential Transmitter
        3. 5.3.4.3 CEA/UART Driver
        4. 5.3.4.4 Pullup/Pulldown Resistors
      5. 5.3.5 OTG Electrical Characteristics
        1. 5.3.5.1 OTG VBUS Electrical Characteristics
        2. 5.3.5.2 OTG ID Electrical Characteristics
    4. 5.4 MADC
      1. 5.4.1 General Description
      2. 5.4.2 MADC Electrical Characteristics
      3. 5.4.3 Channel Voltage Input Range
        1. 5.4.3.1 Sequence Conversion Time (Real-Time or Nonaborted Asynchronous)
    5. 5.5 LED Drivers
      1. 5.5.1 General Description
    6. 5.6 Keyboard
      1. 5.6.1 Keyboard Connection
    7. 5.7 Clock Specifications
      1. 5.7.1 Clock Features
      2. 5.7.2 Input Clock Specifications
        1. 5.7.2.1 Clock Source Requirements
        2. 5.7.2.2 HFCLKIN
        3. 5.7.2.3 32-kHz Input Clock
          1. 5.7.2.3.1 External Crystal Description
          2. 5.7.2.3.2 External Clock Description
      3. 5.7.3 Output Clock Specifications
        1. 5.7.3.1 32KCLKOUT Output Clock
        2. 5.7.3.2 HFCLKOUT Output Clock
        3. 5.7.3.3 Output Clock Stabilization Time
    8. 5.8 Debouncing Time
    9. 5.9 External Components
  6. 6Audio/Voice Module (TPS65930 Device Only)
    1. 6.1 Audio/Voice Downlink (RX) Module
      1. 6.1.1 Predriver for External Class-D Amplifier
        1. 6.1.1.1 Predriver Output Characteristics
        2. 6.1.1.2 External Components and Application Schematics
      2. 6.1.2 Vibrator H-Bridge
        1. 6.1.2.1 Vibrator H-Bridge Output Characteristics
        2. 6.1.2.2 External Components and Application Schematics
      3. 6.1.3 Carkit Output
      4. 6.1.4 Digital Audio Filter Module
      5. 6.1.5 Boost Stage
    2. 6.2 Audio Uplink (TX) Module
      1. 6.2.1 Microphone Bias Module
        1. 6.2.1.1 Analog Microphone Bias Module Characteristics
        2. 6.2.1.2 Silicon Microphone Module Characteristics
      2. 6.2.2 FM Radio/Auxiliary Input
        1. 6.2.2.1 External Components
      3. 6.2.3 Uplink Characteristics
      4. 6.2.4 Microphone Amplification Stage
      5. 6.2.5 Carkit Input
      6. 6.2.6 Digital Audio Filter Module
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
      2. 7.1.2 Device Nomenclature
    2. 7.2 Community Resources
    3. 7.3 Related Links
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Export Control Notice
    7. 7.7 Glossary
    8. 7.8 Additional Acronyms
  8. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Packaging Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

The following products support development of the TPS65920 and TPS65930 device applications:

Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE): including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target software needed to support any TPS65920 and TPS65930 device applications.

Hardware Development Tools: Extended Development System (XDS™) Emulator

7.1.2 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TPS65930). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    PPrototype (X), preproduction (P), or qualified/production device (blank). A blank in the symbol or part number is collapsed so there are no gaps between characters.
    A Mask set version descriptor (initial silicon = blank, first silicon revision = A, second silicon revision = B, ...). Initial silicon version is ES1.0; first revision can be named ES2.0, ES1.1, or ES1.01, depending on the level of change. Note: Device name is a maximum of 10 characters.
    YMYear month
    LLLLSLot code
    $Fab planning code

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZCH) and the temperature range (for example, blank is the default commercial temperature range).

For orderable part numbers of TPS65920 and TPS65930 devices in the ZCH package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

swcs032-001.gifFigure 7-1 Device Nomenclature

7.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS65930 Click here Click here Click here Click here Click here
TPS65920 Click here Click here Click here Click here Click here

7.4 Trademarks

SmartReflex, OMAP, E2E are trademarks of Texas Instruments.

7.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from disclosing party under nondisclosure obligations (if any), or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

7.8 Additional Acronyms

Additional acronyms used in this data sheet are described below.

ADC Analog-to-digital converter
ALC Automatic level control
ASIC Application-specific integrated circuit
BGA Ball grid array
BW Signal bandwidth
CMOS Complementary metal oxide semiconductor
CMT Cellular mobile telephone
CPU Central processing unit
DAC Digital-to-analog converter
DBB Digital baseband
DCR Data capture record
DM Data manual
DSP Digital signal processor
DVFS Dynamic voltage and frequency scaling
ESD Electrostatic discharge
ESR Equivalent series resistance
FET Field effect transistor
FS Full speed
FSR Full-scale range
GND Ground
GP General-purpose
GPIO General-purpose input/output
hiZ High impedance
HS High speed or high security
HW Hardware
I2C Inter-integrated circuit
I2S Inter IC sound
IC Integrated circuit
ICN Idle channel noise
ID Identification
IDDQ Direct drain quiescent current
IF Interface
IO or I/O Input/output
JTAG Joint Test Action Group, IEEE 1149.1 standard
LDO Low-dropout regulator
LED Light-emitting diode
LJF Left-justified format
LS Low speed
MADC Monitoring analog-to-digital converter
MMC Multimedia card
NA, N/A Not applicable
NRZI Nonreturn to zero inverted
OCP Open-core protocol
OTG On-the-Go
PBGA Plastic ball grid array
PCB Printed circuit board
PD Pulldown
PDM Pulse density modulated
PFM Pulse frequency modulation
PLL Phase-locked loop
POL Polarity
POR Power-on reset
PSR Power-supply rejection
PSRR Power-supply rejection ratio
PU Pullup
PWL Pulse-width length
PWM Pulse-width modulation
PWT Pulse-width time
RJF Right-justified format
RTC Real-time clock
RX Receive
SDI Serial display interface
SMPS Switch-mode power supplies
SNR Signal-to-noise ratio
SW Software
SYNC/SYNCHRO Synchronization
SYS System
TBD To be defined
THRU Feed through
TRM Technical reference manual
TX Transmit
UART Universal asynchronous receiver/transmitter
ULPI UTMI+ low pin Interface
UPR Uninterrupted power rail
USB Universal serial bus
UTMI USB transceiver macrocell Interface