SLVSAJ4C September   2010  – October 2017

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Power Dissipation Ratings
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Capacitor Selection for Stability
      3. 7.3.3 Output Noise
      4. 7.3.4 Power-Supply Rejection
      5. 7.3.5 Current Limit
      6. 7.3.6 Thermal Protection
      7. 7.3.7 Adjustable Voltage Applications
  8. 8Device and Documentation Support
    1. 8.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

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発注情報

Specifications

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage range, VIN –11 0.3 V
Noise reduction pin voltage range, VNR –11 5.5 V
Enable voltage range, VEN –VIN 5.5 V
Output current, IOUT Internally limited
Output short-circuit duration Indefinite
Continuous total power dissipation, PD See the Power Dissipation Ratings table
Latch-up performance meets 100 mA per AEC-Q100 | Class I 100 mA
Junction temperature range, TJ –55 150 °C
Storage temperature, Tstg –65 150 °C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.

ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±500
Machine model ±200
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Power Dissipation Ratings

BOARD PACKAGE RθJC RθJA DERATING FACTOR
ABOVE TA = 25°C
TA  ≤ 25°C
POWER RATING
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
Low-K(1) DBV 64°C/W 255°C/W 3.9 mW/°C 390 mW 215 mW 155 mW
High-K(2) DBV 64°C/W 180°C/W 5.6 mW/°C 560 mW 310 mW 225 mW
The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3- inch (7,62-cm × 7,62-cm), two-layer board with 2-ounce (0.071-mm thick) copper traces on top of the board.
The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch × 3 inch (7,62-cm × 7,62-cm), multilayer board with 1-ounce (0.035-mm thick) internal power and ground planes and 2-ounce (0.071-mm thick) copper traces on the top and bottom of the board.

Electrical Characteristics

Over operating junction temperature range, VIN = VOUTnom – 0.5V, IOUT = 1mA, VEN = 1.5V, COUT = 2.2μF, and CNR = 0.01μF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range(1) –10 –2.7 V
VOUT Accuracy Nominal TJ = 25°C –1% 1%
TPS723xx-Q1 versus
VIN / IOUT / T
–10V ≤ VIN  ≤ VOUT – 0.5V,
10 μA ≤ IOUT  ≤ 200 mA
–2% ±1% 2%
VOUT% / VIN Line regulation –10 V ≤ VIN  ≤ VOUT(nom) – 0.5 V 0.04 %/V
VOUT% / IOUT Load regulation 0 mA ≤ IOUT  ≤ 200 mA 0.002 %/mA
VDO Dropout voltage at VOUT = 0.96 × VOUTnom IOUT = 200 mA 280 500 mV
ICL Current limit VOUT = 0.85 × VOUT(nom) 300 550 800 mA
IGND Ground pin current IOUT = 0 mA (IQ),
–10 V ≤ VIN  ≤ VOUT – 0.5 V
130 200 μA
IOUT = 200 mA,
–10 V ≤ VIN  ≤ VOUT – 0.5 V
350 500
ISHDN Shutdown ground pin current –0.4 V ≤ VEN  ≤ 0.4 V,
–10V ≤ VIN  ≤ VOUT – 0.5 V
0.1 2 μA
PSRR Power-supply rejection ratio IOUT = 200 mA, 1 kHz,
CIN = COUT = 10 μF
65 dB
IOUT = 200 mA, 10 kHz,
CIN = COUT = 10 μF
48
Vn Output noise voltage COUT = 10 μF, 10 Hz to 100 kHz,
IOUT = 200 mA
60 μVRMS
tSTR Startup time VOUT = –2.5 V, COUT = 1 μF,
RL = 25 Ω
1 ms
VEN(HI) Enable threshold positive 1.5 V
VEN(LO) Enable threshold negative –1.5 V
VDIS(HI) Disable threshold positive 0.4 V
VDIS(LO) Disable threshold negative –0.4 V
IEN Enable pin current –10 V ≤ VIN ≤ VOUT  – 0.5 V,
–10 V ≤ VEN ≤ ±3.5 V
0.1 2 μA
TSD Thermal shutdown temperature Shutdown, temperature increasing 165 °C
Reset, temperature decreasing 145
TJ Operating junction temperature –40 125 °C
Maximum VIN = (VOUT – VDO) or – 2.7 V, whichever is more negative.

Typical Characteristics

TPS723xx-Q1 at VIN = VOUTnom – 0.5 V, IOUT = 1 mA, VEN = 1.5 V, COUT = 2.2 μF, and CNR = 0.01 μF, unless otherwise noted.
TPS72325-Q1 TPS72301-Q1 tc_vo-vi_lvs346.gif
Figure 1. Output Voltage vs Input Voltage
TPS72325-Q1 TPS72301-Q1 tc_vdo-iout_lvs346.gif
Figure 3. Dropout Voltage vs Output Current
TPS72325-Q1 TPS72301-Q1 tc_ignd-vi_lvs346.gif
Figure 5. Ground Current vs Input Voltage
TPS72325-Q1 TPS72301-Q1 tc_ignd-tmp_lvs346.gif
Figure 7. Ground Current vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_standby-tmp_lvs346.gif
Figure 9. Standby Current vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_reg-tmp_lvs346.gif
Figure 11. Line and Load Regulation vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_load_delta_hi_lvs346.gif
Figure 13. Load Transient Response
TPS72325-Q1 TPS72301-Q1 tc_start_0uf_lvs346.gif
Figure 15. Start-Up Response
TPS72325-Q1 TPS72301-Q1 tc_pwr_up_dwn_lvs346.gif
Figure 17. Power Up and Power Down
TPS72325-Q1 TPS72301-Q1 tc_noise-time_lvs346.gif
Figure 19. Output Noise vs Time
TPS72325-Q1 TPS72301-Q1 tc_noise-frq_0uf_lvs346.gif
Figure 21. Noise Spectral Density vs Frequency
TPS72325-Q1 TPS72301-Q1 tc_psrr-frq_0p01v_lvs346.gif
Figure 23. PSRR vs Frequency
TPS72325-Q1 TPS72301-Q1 tc_vo-tmp_lvs346.gif
Figure 2. Output Voltage vs Ambient Temperature
TPS72325-Q1 TPS72301-Q1 tc_vdo-tmp_lvs346.gif
Figure 4. TPS723xx-Q1 Dropout Voltage vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_ignd-iout_lvs346.gif
Figure 6. Ground Current vs Output Current
TPS72325-Q1 TPS72301-Q1 tc_cur_lim-tmp_lvs346.gif
Figure 8. Current Limit vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_enable-tmp_lvs346.gif
Figure 10. Enable Pin Current vs Junction Temperature
TPS72325-Q1 TPS72301-Q1 tc_line_trans_lvs346.gif
Figure 12. Line Transient Response
TPS72325-Q1 TPS72301-Q1 tc_load_delta_lo_lvs346.gif
Figure 14. Load Transient Response
TPS72325-Q1 TPS72301-Q1 tc_start_0p01uf_lvs346.gif
Figure 16. Start-Up Response
TPS72325-Q1 TPS72301-Q1 tc_noise-cnr_lvs346.gif
Figure 18. Total Noise vs CNR
(10 Hz to 100 kHz)
TPS72325-Q1 TPS72301-Q1 tc_noise-frq_0p01uf_lvs346.gif
Figure 20. Noise Spectral Density vs Frequency
TPS72325-Q1 TPS72301-Q1 tc_psrr-frq_0v_lvs346.gif
Figure 22. PSRR vs Frequency