JAJSEQ7D February   2018  – August 2019 TPS7A05

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション回路
      2.      グランド電流と出力電流との関係
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Undervoltage Lockout (UVLO)
      5. 7.3.5 Enable
      6. 7.3.6 Internal Foldback Current Limit
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Mode
      2. 7.4.2 Dropout Mode
      3. 7.4.3 Disable Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Special Considerations When Ramping Down VIN and Enable
      4. 8.1.4 Load Transient Response
      5. 8.1.5 Dropout Voltage
        1. 8.1.5.1 Behavior When Transitioning From Dropout Into Regulation
        2. 8.1.5.2 Behavior of Output Resulting From Line Transient When in Dropout
      6. 8.1.6 Undervoltage Lockout (UVLO) Operation
      7. 8.1.7 Power Dissipation (PD)
        1. 8.1.7.1 Estimating Junction Temperature
        2. 8.1.7.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Design Considerations
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 SPICEモデル
      2. 11.1.2 デバイスの項目表記
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

DQN Package
1-mm × 1-mm, 4-Pin X2SON
Top View
DBV Package
5-Pin SOT-23
Top View
DBZ Package
3-Pin SOT-23
Top View
YKA Package
4-Pin DSBGA, 0.35-mm Pitch
Top View
YKA Package
4-Pin DSBGA, 0.35-mm Pitch
Bottom View

Pin Functions

PIN I/O DESCRIPTION
NAME DQN DBV DBZ YKA
IN 4 1 3 A1 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground as listed in the Recommended Operating Conditions table. Place the input capacitor as close to input of the device as possible.
EN 3 3 — B1 Input Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low disables the device. If enable functionality is not required, this pin must be connected to IN. VEN must not exceed VIN.
GND 2 2 1 B2 — Ground pin. This pin must be connected to ground on the board.
OUT 1 5 2 A2 Output Regulated output pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground. Follow the recommended capacitor value as listed in the Recommended Operating Conditions table. Place the output capacitor as close to output of the device as possible.
NC — 4 — — — No connect pin. This pin is not internally connected. Connect to ground or leave floating.
Thermal pad Pad — — — — Connect the thermal pad to a large-area ground plane. This pad is not an electrical connection to the device ground.