SBVS267A January   2016  – February 2016 TPS7A85

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Low-Noise, High-PSRR Output
      2. 7.3.2  Integrated Resistance Network (ANY-OUT)
      3. 7.3.3  Bias Rail
      4. 7.3.4  Power-Good (PG) Function
      5. 7.3.5  Programmable Soft-Start
      6. 7.3.6  Internal Current Limit (ILIM)
      7. 7.3.7  Enable
      8. 7.3.8  Active Discharge Circuit
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with 1.1 V ≤ VIN < 1.4 V
      2. 7.4.2 Operation with 1.4 V ≤ VIN ≤ 6.5 V
      3. 7.4.3 Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Recommended Capacitor Types
      2. 8.1.2  Input and Output Capacitor Requirements (CIN and COUT)
      3. 8.1.3  Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      4. 8.1.4  Feed-Forward Capacitor (CFF)
      5. 8.1.5  Soft-Start and In-Rush Current
      6. 8.1.6  Optimizing Noise and PSRR
        1. 8.1.6.1 Charge Pump Noise
      7. 8.1.7  ANY-OUT Programmable Output Voltage
      8. 8.1.8  ANY-OUT Operation
      9. 8.1.9  Increasing ANY-OUT Resolution for LILO Conditions
      10. 8.1.10 Current Sharing
      11. 8.1.11 Adjustable Operation
      12. 8.1.12 Sequencing Requirements
        1. 8.1.12.1 Sequencing with a Power-Good DC-DC Converter Pin
        2. 8.1.12.2 Sequencing with a Microcontroller (MCU)
      13. 8.1.13 Power-Good (PG) Operation
      14. 8.1.14 Undervoltage Lockout (UVLO) Operation
      15. 8.1.15 Dropout Voltage (VDO)
      16. 8.1.16 Behavior when Transitioning from Dropout into Regulation
      17. 8.1.17 Load Transient Response
      18. 8.1.18 Negatively-Biased Output
      19. 8.1.19 Reverse Current Protection
      20. 8.1.20 Power Dissipation (PD)
        1. 8.1.20.1 Estimating Junction Temperature
        2. 8.1.20.2 Recommended Area for Continuous Operation (RACO)
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Input, Low-Output (LILO) Voltage Conditions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application for a 5.0-V Rail
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS7A85. The summary information for this fixture is shown in Table 8.

Table 8. Design Kits and Evaluation Modules

NAME LITERATURE NUMBER
TPS7A8300EVM-209 Evaluation Module SLVU919
TPS7A8300EVM-579 Evaluation Module SBVU021

The EVM can be requested at the Texas Instruments web site through the TPS7A85 product folder.

11.1.1.2 Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS7A85 is available through the TPS7A85 product folder under simulation models.

11.1.2 Device Nomenclature

Table 9. Ordering Information(1)

PRODUCT DESCRIPTION
TPS7A85YYZ YY is the package designator.
Z is the package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • TPS3702 Data Sheet, SBVS251
  • TPS7A8300EVM-209 Evaluation Module, SLVU919
  • TPS7A8300EVM-579 Evaluation Module, SBVU021
  • A Topical Index of TI LDO Application Notes, SBVA026
  • Pros and Cons of Using a Feed-Forward Capacitor with a Low Dropout Regulator, SBVA042
  • 6A Current-Sharing Dual LDO, TIDU421

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

ANY-OUT, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.