JAJSC12D October   2013  – April 2018

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      可変出力オプション
      2.      固定出力オプション
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Enable (EN)
      2. 9.3.2 Regulated Output (VOUT)
      3. 9.3.3 Power-On-Reset (RESET)
      4. 9.3.4 Reset Delay Timer (DELAY)
      5. 9.3.5 Adjustable Output Voltage (ADJ for TPS7B6701)
      6. 9.3.6 Undervoltage Shutdown
      7. 9.3.7 Thermal Shutdown
      8. 9.3.8 Thermal Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With VIN < 4 V
      2. 9.4.2 Operation With EN Control
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Power Dissipation and Thermal Considerations
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Dropout Recovery
      1. 11.1.1 LDO Dropout Recovery Explained
      2. 11.1.2 TPS7B67xx-Q1 Dropout During Startup
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Enhanced Thermal Pad
      2. 12.1.2 Package Mounting
      3. 12.1.3 Board Layout Recommendations to Improve PSRR and Noise Performance
      4. 12.1.4 Additional Layout Considerations
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 関連リンク
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12.1.1 Enhanced Thermal Pad

For the PWP package, TI recommends to layout an enhanced thermal pad on the board in order to realize better thermal impedance; see Figure 27. No extra board size is required and the standard operation is not influenced by this layout.

TPS7B6701-Q1 TPS7B6733-Q1 TPS7B6750-Q1 pwp_enhanced_slvscb2.gifFigure 27. Thermally Enhanced Layout for the PWP Package (TPS7B6701-Q1)