JAJSLN2 November   2021 TPS7H1210-SEP

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Enable Pin Operation
      3. 7.3.3 Programmable Soft-Start
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Operation
      2. 8.1.2 Capacitor Recommendations
      3. 8.1.3 Noise Reduction and Feed-Forward Capacitor Requirements
      4. 8.1.4 Power-Supply Rejection Ratio (PSRR)
      5. 8.1.5 Output Noise
      6. 8.1.6 Transient Response
      7. 8.1.7 Post DC-DC Converter Filtering
      8. 8.1.8 Power for Precision Analog
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don’ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3 Thermal Performance

The high-current and high-voltage characteristics of the TPS7H1210-SEP means that, often enough, high power (heat) is dissipated from the device itself. This heat, if dissipated into the PCB, creates a temperature gradient in the surrounding area that causes nearby components to react to this temperature change (drift). In high-performance systems, such drift may degrade overall system accuracy and precision.

The heat generated by the device is a result of the power dissipation, which depends on input voltage and load conditions. Power dissipation (PD) can be approximated by calculating the product of the output current times the voltage drop across the output pass element, as shown in Equation 5:

Equation 5. P D = V I N - V O U T × I O U T

Be sure the PCB is able to effectively dissipate the heat resulting from the power dissipation.