4 Revision History
Changes from A Revision (June 2016) to B Revision
- Changed DLA drawing number Go
- Changed radiation performance feature summary Go
- Changed feature description for supported DDR termination applications Go
- Changed VTTREF accuracy feature Go
- Changed description of supported DDR applications Go
- Added package weight to Device Information tableGo
- Changed pin name references throughout document to be consistent Go
- Added additional thermal metricsGo
- Added clarification of TJ temperature range in Electrical Characteristics tableGo
- Changed ambiguous tolerance specification for VTT/VO to explicitly specify min/max rangeGo
- Changed UVLO threshold hysteresis to own table entry Go
- Changed naming on VTTREF plots for consistency Go
- Added ceramic to capacitor description to meet stability requirementsGo
- Added correct cross reference for output current limitGo
- Changed wording for clarity for VIN/VDD Go
- Changed comment to reflect total ESR Go
- JEDEC specification references Go
- Changed to improved transient plot and descriptionGo
- Added or smaller for layout thermal via size Go
- Changed to improved recommended layout diagram. Go
- Changed wording to clarify power dissipation description Go
Changes from * Revision (December 2015) to A Revision
- Changed title of data sheetGo
- Added new RHA device featuresGo
- Deleted soft start feature statementGo
- Deleted built-in VREF statementGo
- Deleted misplaced pin functionGo
- Changed absolute maximum rating for EN pin to 3.6 VGo
- Deleted specification for PG pin sink currentGo
- Deleted specification for peak output currentGo
- Deleted unnecessary graphs from the Typical Characteristics sectionGo
- Changed typo for VTTREF disabling lower threshold from 0.375 to 0.76 VGo
- Edited content to reflect there is no built-in soft start and added details regarding tracking at startupGo