Thermal dissipation is the primary consideration for TPS92633 layout.
- TI recommends large thermal dissipation area in
both top and bottom layers of PCB. The copper pouring area in same layer with
TPS92633 footprint should directly cover the
thermal pad land of the device with wide connection as much as possible. The
copper pouring in opposite PCB layer or inner layers should be connected to
thermal pad directly through multiple thermal vias.
- TI recommends to place R(RESx)
resistors away from the TPS92633 device with more than 20-mm distance because
R(RESx) resistors are dissipating some amount of the power as
well as the TPS92633. It is better to place two heat source components apart
to reduce the thermal accumulation concentrated at small PCB area. The large
copper pouring area is also required surrounding the R(RESx)
resistors for helping thermal dissipating.
The noise immunity is the secondary consideration for TPS92633 layout.
- TI recommends to place the noise decoupling capacitors for SUPPLY, ICTRL and IREF pins as close as possible to the pins.
- TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track to SUPPLY pin.