JAJSTS9 October   2024 TPSI31P1-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristic Curves
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Transmission of the Enable State
      2. 6.3.2 Power Transmission
      3. 6.3.3 Gate Driver
      4. 6.3.4 Chip Enable (CE)
      5. 6.3.5 Comparators
      6. 6.3.6 VDDP, VDDH, and VDDM Under-voltage Lockout (UVLO)
      7. 6.3.7 Keep-off Circuitry
      8. 6.3.8 Thermal Shutdown
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 CDIV1, CDIV2 Capacitance
      3. 7.2.3 Application Curves
      4. 7.2.4 Insulation Lifetime
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 ドキュメントの更新通知を受け取る方法
    3. 8.3 サポート・リソース
    4. 8.4 Trademarks
    5. 8.5 静電気放電に関する注意事項
    6. 8.6 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

5.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
DVX (SSOP)
16 PINS
RϴJA Junction-to-ambient thermal resistance 82.5 °C/W
RϴJC(top) Junction-to-case (top) thermal resistance 39.3 °C/W
RΘJB Junction-to-board thermal resistance 42.3 °C/W
ψJT Junction-to-top characterization parameter 14.7 °C/W
ΨJB Junction-to-board characterization parameter 41.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.