JAJSN49 January   2022 TPSM5D1806E

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 12 V)
    7. 6.7 Typical Characteristics (VIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjustable Output Voltage
      2. 7.3.2  Frequency Selection
        1. 7.3.2.1 Synchronization
        2. 7.3.2.2 Allowable Switching Frequency
      3. 7.3.3  Minimum and Maximum Input Voltage
      4. 7.3.4  Recommended Settings
      5. 7.3.5  Device Mode Configuration
        1. 7.3.5.1 MODE1 (Operating Mode and Phase Position)
        2. 7.3.5.2 MODE2 (Setting the Switching Frequency)
      6. 7.3.6  Input Capacitors
      7. 7.3.7  Minimum Required Output Capacitance
      8. 7.3.8  Ambient Temperature Versus Total Power Dissipation
      9. 7.3.9  Remote Sense
      10. 7.3.10 Enable (EN) and Undervoltage Lockout (UVLO)
      11. 7.3.11 Soft Start
      12. 7.3.12 Power Good
      13. 7.3.13 Safe Start-Up into Pre-Biased Outputs
      14. 7.3.14 BP5
      15. 7.3.15 Overcurrent Protection
      16. 7.3.16 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application (Dual Outputs)
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Capacitor Selection
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application (Paralleled Outputs)
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 Output Voltage Setpoint
          2. 8.2.4.2.2 Input Capacitors
          3. 8.2.4.2.3 Output Capacitor Selection
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Package Specifications
      2. 10.2.2 EMI
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 10-1 and Figure 10-2 show typical PCB layouts. The following are some considerations for an optimized layout.

  • Use large copper areas for power planes (VIN, VOUT, and PGND) to minimize conduction loss and thermal stress.
  • Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
  • Locate additional output capacitors between the ceramic capacitor and the load.
  • Connect AGND to PGND at a single point.
  • Place RFBT and RFBB as close as possible to the FB pin.
  • Use multiple vias to connect the power planes to internal layers.