JAJSKF5D September   2021  – November 2024 TPSM82864A , TPSM82866A

PRODMIX  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 Forced PWM Mode
      3. 7.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 7.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 7.3.5 Soft Start
      6. 7.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Output Discharge
      3. 7.4.3 Power Good (PG)
      4. 7.4.4 Output Voltage and Mode Selection (VSET/MODE)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting The Output Voltage
        2. 8.2.2.2 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPSM8286xA UNIT
RDM (23 PINS) RDJ (23 PINS) RCF (15 PINS)
JEDEC 51-5 EVM JEDEC 51-5 EVM JEDEC 51-7 EVM
RθJA Junction-to-ambient thermal resistance 43.2 25.9 43.3 25.4 66.4 29.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.5 n/a(2) 34.3 n/a(2) 31.8 n/a(2) °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance 21.1 n/a(2) 22.2 n/a(2) n/a(3) n/a(2) °C/W
RθJB Junction-to-board thermal resistance 14.9 n/a(2) 10.8 n/a(2) 19.5 n/a(2) °C/W
ΨJT Junction-to-top characterization parameter 6.8 3.7 3.6 2.4 (-2.2)(4) (-4.2)(4) °C/W
ΨJB Junction-to-board characterization parameter 14.8 12.7 10.7 10.9 18.8 15.5 °C/W
(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Not applicable to an EVM.
(3) Only applicable for packages with exposed thermal pad.
(4) The junction temperature is lower than the inductor temperature leading to a temperature increase towards the top of the package