TRF0206-SP is a wide-band feedback amplifier with approximately 13 dB of gain. When designing with a wideband RF amplifier with relatively high gain, take certain board layout precautions to maintain stability and optimal performance. Use a multilayered board to maintain signal and power integrity and thermal performance. The following figure shows an example of a good layout. In this figure, only the top layer is shown.

Route the RF input and output lines as grounded coplanar waveguide (GCPW) lines. Make sure the second layer is a continuous ground layer without any ground-cuts near the amplifier area. Match the output differential lines in length to minimize phase imbalance. Use small footprint passive components wherever possible. Also take care of the input side layout. Route the INP with a 50-Ω line. Make sure that the NM pin termination has low parasitics by placing the ac-coupling capacitor and the 50-Ω resistor very close to the device. Use an RF quality 50‑Ω resistor for termination. Make sure that ground planes on the top and internal layers are well stitched with vias.

As Figure 8-4 shows, place thermal vias under the device that connect the top thermal pad with ground planes in the inner layers of the PCB. Also connect the thermal pad to the top layer ground plane through the ground pins.