The TRF0206-SP is packaged in a 6.10 mm × 6.20 mm LCCC-FC package that has excellent thermal properties. Connect the device thermal pad to a ground plane. Short the ground plane to the other ground pins of the device at four corners, if possible, to allow heat propagation to the top layer of the PCB. Use a thermal via that connects the thermal pad plane on the top layer of the PCB to the inner layer ground planes to allow heat propagation to the inner layers.

Limit the total power dissipation to keep the device junction temperature less than 150°C for instantaneous power and less than 125°C for continuous power.