JAJSKD0 December   2023 TRF1305B2

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - TRF1305B2
    6. 6.6 Typical Characteristics - TRF1305B2
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential Amplifier
      2. 7.3.2 Output Common-Mode Control
      3. 7.3.3 Internal Resistor Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
        1. 7.4.1.1 Input Common-Mode Extension
      2. 7.4.2 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Interface Considerations
        1. 8.1.1.1 Single-Ended Input
        2. 8.1.1.2 Differential Input
        3. 8.1.1.3 DC Coupling Considerations
      2. 8.1.2 Gain Adjustment With External Resistors in a Differential Input Configuration
    2. 8.2 Typical Application
      1. 8.2.1 TRF1305x2 as ADC Driver in a Zero-IF Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Supply Voltages
      2. 8.3.2 Single-Supply Operation
      3. 8.3.3 Split-Supply Operation
      4. 8.3.4 Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4.1.1 Thermal Considerations

The TRF1305x2 are packaged in a WQFN-FCRLF package that has excellent thermal properties. Connect the thermal pads underneath the devices to the thermally dissipative ground plane on the board. For good thermal design, use thermal vias to connect the thermal pad plane on the top layer of the PCB to the ground planes in the inner layers.

Limit the total power dissipation to keep the device junction temperature less than 150°C for instantaneous power, and less than 125°C for continuous power.