Populated RoHS-compliant evaluation boards are available for testing the TRF37T05 as a stand-alone device. Contact your local TI representative for information on ordering these evaluation modules, or see the TRF37T05 product folder on the TI website. In addition, the TRF37T05 can be evaluated with the DAC348x (quad/dual 16-bit, 1.25GSPS) EVM driving the baseband inputs through a seamless interface at 0.25V common-mode voltage.

10.1 Layout Guidelines

The TRF37T05 device is fitted with a ground slug on the back of the package that must be soldered to the printed circuit board (PCB) ground with adequate ground vias to ensure a good thermal and electrical connection. The recommended via pattern and ground pad dimensions are shown in Figure 76. The recommended via diameter is 10 mils (0.10 in or 0,25 mm). The ground pins of the device can be directly tied to the ground slug pad for a low-inductance path to ground. Additional ground vias may be added if space allows.

Decoupling capacitors at each of the supply pins are strongly recommended. The value of these capacitors should be chosen to provide a low-impedance RF path to ground at the frequency of operation. Typically, the value of these capacitors is approximately 10 pF or lower.

The device exhibits symmetry with respect to the quadrature input paths. It is recommended that the PCB layout maintain this symmetry in order to ensure that the quadrature balance of the device is not impaired. The I/Q input traces should be routed as differential pairs and the respective lengths all kept equal to each other. On the RF traces, maintain proper trace widths to keep the characteristic impedance of the RF traces at a nominal 50 Ω.

10.2 Layout Example

NOTE:

Dimensions are in millimeters (mm).

Figure 76. PCB Ground Via Layout Guide